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1.发明授权公开(公告)号：US08994259B2
公开(公告)日：2015-03-31
申请号：US13852332
申请日：2013-03-28
申请人： Nichia Corporation
发明人： Hiroto Tamaki , Takayoshi Wakaki , Tadao Hayashi , Yoshiki Sato , Daisuke Oyamatsu , Takafumi Sugiyama , Takao Kosugi
CPC分类号： F21V9/30 , B05D5/06 , C23C16/45525 , F21K9/60 , F21V7/00 , F21V13/08 , F21Y2115/10 , F21Y2115/30 , H01L31/055 , H01L33/502 , H01L33/505 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H05B33/12 , Y02E10/52 , Y10T428/24364 , Y10T428/24372 , Y10T428/24413 , Y10T428/24421 , H01L2924/00014
摘要： A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.
摘要翻译： 波长转换无机部件可以在基体上包括基体和无机粒子层。 无机粒子层可以包括被配置为吸收第一波长的光并发射与第一波长不同的第二波长的光的无机波长转换物质的粒子。 无机颗粒层可以包括多个颗粒的附聚物。 多个颗粒中的每一个与至少一个其它颗粒或基体接触。 覆盖层包括无机材料，并且覆盖层连续地覆盖基体的表面和颗粒的表面。 无机颗粒层具有由颗粒包围的空隙，或由颗粒和基体和覆盖层之一组成的间隙。
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公开(公告)号：US10978625B2
公开(公告)日：2021-04-13
申请号：US16422653
申请日：2019-05-24
申请人： NICHIA CORPORATION
发明人： Naoki Musashi , Takayoshi Wakaki
摘要： A method for forming a light-transmissive member includes irradiating a principal surface of a cured resin body containing a silicone resin with ultraviolet rays through a photomask comprising one or more light-blocking regions and one or more light-transmissive regions, so as to cause a height of one or more first regions of the principal surface, which correspond to the one or more light-blocking regions of the photomask, to be different than a height of one or more second regions of the principal surface, which correspond to the one or more light-transmissive regions of the photomask.
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公开(公告)号：US10431720B2
公开(公告)日：2019-10-01
申请号：US16035510
申请日：2018-07-13
申请人： NICHIA CORPORATION
发明人： Takaaki Tada , Takayoshi Wakaki
摘要： A light emitting device includes: a light emitting element including: a semiconductor structure including an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, each containing a nitride semiconductor, a p-electrode disposed on a portion of a surface of the p-type semiconductor layer on a side opposite to a surface provided with the active layer, and an n-electrode disposed on a surface of the n-type semiconductor layer on a side opposite to a surface provided with the active layer in a region other than a region facing the p-electrode; and a protective film continuously covering a surface of the n-electrode and a surface of the n-type semiconductor layer. The protective film includes a first metal oxide film and a second metal oxide film that are alternately layered, the first metal oxide film containing a first metal, and the second metal oxide film containing a second metal.
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公开(公告)号：US11605766B2
公开(公告)日：2023-03-14
申请号：US17135011
申请日：2020-12-28
申请人： NICHIA CORPORATION
发明人： Takayoshi Wakaki
摘要： A light-emitting module includes: a light-transmitting lightguide plate; light sources disposed on the lightguide plate, each light source including a light-emitting element and a cover member including a first resin and provided beside a lateral surface of the light-emitting element, with first and second electrodes exposed through the cover member; a light-reflecting member provided on the lightguide plate and provided around the light sources, with the cover members of exposed through the light-reflecting member, wherein the light-reflecting member includes a second resin having a higher hardness than the first resin; a support layer covering the light-reflecting member and the cover members, with the first electrodes and the second electrodes exposed through the support layer, wherein the support layer includes a third resin having a higher hardness than the first resin; and a wiring layer provided on the support layer and connected to the first electrodes and the second electrodes.
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公开(公告)号：US11088305B2
公开(公告)日：2021-08-10
申请号：US16282286
申请日：2019-02-21
申请人： NICHIA CORPORATION
发明人： Naoki Musashi , Takayoshi Wakaki
IPC分类号： H01L33/58 , H01L33/54 , H01L33/56 , H01L25/075 , H01L33/50 , H01L33/62 , H01L33/48 , H01L33/44
摘要： A method for forming a light-transmissive member includes: a step (A) including locating a cured resin body having a principal surface and containing a silicone resin, and a die including a plurality of convex portions, such that the principal surface and the plurality of convex portions face each other, and pressing the die onto the principal surface of the resin body in a heated state to form a plurality of concave portions at the principal surface; and a step (B) including, after the step (A), irradiating the principal surface of the resin body with ultraviolet rays.
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公开(公告)号：US10050182B2
公开(公告)日：2018-08-14
申请号：US15851459
申请日：2017-12-21
申请人： NICHIA CORPORATION
发明人： Takaaki Tada , Takayoshi Wakaki
摘要： A light emitting device includes: a light emitting element including: a semiconductor structure including an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, each containing a nitride semiconductor, a p-electrode disposed on a portion of a surface of the p-type semiconductor layer on a side opposite to a surface provided with the active layer, and an n-electrode disposed on a surface of the n-type semiconductor layer on a side opposite to a surface provided with the active layer in a region other than a region facing the p-electrode; and a protective film continuously covering a surface of the n-electrode and a surface of the n-type semiconductor layer. The protective film includes a first metal oxide film and a second metal oxide film that are alternately layered, the first metal oxide film containing a first metal, and the second metal oxide film containing a second metal.
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公开(公告)号：US11923488B2
公开(公告)日：2024-03-05
申请号：US17351928
申请日：2021-06-18
申请人： NICHIA CORPORATION
发明人： Naoki Musashi , Takayoshi Wakaki
IPC分类号： H01L33/58 , H01L33/54 , H01L33/56 , H01L25/075 , H01L33/44 , H01L33/48 , H01L33/50 , H01L33/62
CPC分类号： H01L33/58 , H01L33/54 , H01L33/56 , H01L25/0753 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/62 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0083 , H01L2933/0091
摘要： A light emitting device includes: a light emitting element having a top surface; and a light-transmissive member covering at least the top surface of the light emitting element, the light-transmissive member having a principal surface located above the top surface of the light emitting element. The principal surface of the light-transmissive member comprises a plurality of concave portions.
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公开(公告)号：US10355173B2
公开(公告)日：2019-07-16
申请号：US15837434
申请日：2017-12-11
申请人： NICHIA CORPORATION
摘要： A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material; and covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation.
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公开(公告)号：US09893239B2
公开(公告)日：2018-02-13
申请号：US15371888
申请日：2016-12-07
申请人： NICHIA CORPORATION
发明人： Takaaki Tada , Takayoshi Wakaki
CPC分类号： H01L33/44 , H01L33/005 , H01L33/0095 , H01L33/58 , H01L2224/49111 , H01L2224/49175 , H01L2224/8592 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058
摘要： A method of manufacturing a light emitting device includes providing a light emitting element; and forming a protective film on a surface of the light emitting element, wherein the step of forming the protective film includes: (i) providing first quantity of oxygen at the surface of the light emitting element, (ii) combining a first quantity of a first metal with the first quantity of oxygen, (iii) combining a second quantity of oxygen with the first quantity of metal, (iv) combining a first quantity of a second metal, different from the first metal, with the second quantity of oxygen and first quantity of the first metal, and (v) combining a third quantity of oxygen with the first quantity of the second metal.
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公开(公告)号：US09871170B2
公开(公告)日：2018-01-16
申请号：US14299065
申请日：2014-06-09
申请人： NICHIA CORPORATION
CPC分类号： H01L33/44 , H01L33/486 , H01L33/644 , H01L2224/48247 , H01L2224/48257 , Y10T29/49002
摘要： A light emitting device has a light emitting element, a package, a lead, and a cover film. The package is arranged to form at least part of an inner peripheral face of a recess portion. The light emitting element is housed in the recess portion. The lead is disposed on a bottom face of the recess portion. The lead is electrically connected to the light emitting element. The cover film is arranged to cover the inner peripheral face of the recess portion. The cover film has light transmissive and electrical insulation. The package includes a base material and a plurality of particles. The base material includes a resin. A coefficient of thermal expansion of the particles is different from a coefficient of thermal expansion of the base material. The particles are disposed at least near the inner peripheral face of the recess portion.
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