The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20.