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公开(公告)号：US20180222152A1
公开(公告)日：2018-08-09
申请号：US15742994
申请日：2016-07-14
CPC分类号： B32B15/08 , B32B15/088 , B32B15/20 , C08G73/12 , C08K3/36 , C08L27/12 , C08L79/08 , C08L79/085 , C09D127/18 , H05K1/0326 , H05K1/0373 , H05K3/022 , H05K2201/0209 , H05K2201/0212 , C08L63/00
摘要： Resin-clad copper foil improves transmission characteristics by using a bismaleimide resin having a low dielectric constant and a low dielectric loss tangent. The foil can be manufactured without irradiation with ultraviolet rays. A resin composition is laminated on copper foil. The resin composition includes a bismaleimide resin represented by general formula (I), a curing agent, and a filler, the blending amount of the filler is 10 to 200 parts by mass based on 100 parts by mass of a resin component. The resin composition has a complex viscosity at 80° C. of 1×103 Pa·s to 5×105 Pa·s. In general formula (I), X represents an aliphatic, alicyclic or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain, Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group, and a represents a number in a range of 1 to 20.
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公开(公告)号：US12130488B2
公开(公告)日：2024-10-29
申请号：US17624982
申请日：2020-08-28
发明人： Hideyuki Hirano , Keiichiro Hirose , Syoji Nakazono , Akihiko Koyama , Takaya Konishi , Ai Takahashi , Masakatsu Setoguchi
CPC分类号： G02B6/4479 , G02B6/02004
摘要： An optical fiber (10) capable of minimizing strength deterioration includes a core (11) and a clad (12) arranged around the core (11) such that part of the core (11) is exposed. A rough surface portion is provided at least at part of an outer surface of the exposed portion (11a) of the core (11) exposed through the clad (12). The arithmetic surface roughness Ra of the rough surface portion is equal to or greater than 0.2 μm. The average length Rsm of a rough curve element of the rough surface portion is equal to or greater than 17 μm.
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公开(公告)号：US20240335845A1
公开(公告)日：2024-10-10
申请号：US18695259
申请日：2022-09-28
发明人： Masaki HIRANO
CPC分类号： B05B7/04 , B05B7/0075 , B05B7/1463 , B05B7/149
摘要： The film deposition apparatus used in a thermal spraying method includes a spray gun which includes a nozzle, a powder supply unit that supplies a powder to the spray gun as a film deposition raw material, and a gas supply unit that supplies a working gas to the spray gun. The nozzle includes a stainless pipe as a nozzle pipe, a ceramic pipe connected to an upstream portion of the stainless pipe through which the working gas flows, and a nozzle holder into which the ceramic pipe is inserted. The nozzle holder includes a first portion extending in a first direction in which the working gas flows through the nozzle holder. The film deposition apparatus further includes a pipe which connects the powder supply unit and the first portion. A portion of the pipe, which is connected to the first portion, extends in a second direction intersecting the first direction.
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公开(公告)号：US20240182759A1
公开(公告)日：2024-06-06
申请号：US18552174
申请日：2022-03-16
发明人： Yuusuke HARUNA , Hiroshi TAJIMA
摘要： An object of the present disclosure is to provide a conductive adhesive layer in which the connection stability between objects that are conductive members is excellent, and the connection stability is maintained even when the conductive adhesive layer is subjected to high temperature. The conductive adhesive layer is a conductive adhesive layer including a binder component and conductive particles, wherein the conductive particles include conductive particles A having a median diameter of 100% or more of a thickness of the conductive adhesive layer, and conductive particles B having a median diameter of 1 to 50% of the median diameter of the conductive particles A, a content of the conductive particles is 110 to 900 parts by mass based on 100 parts by mass of the binder component, and a mass ratio of the conductive particles A to the conductive particles B is 0.1 to 7.2.
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公开(公告)号：US11937365B2
公开(公告)日：2024-03-19
申请号：US17256931
申请日：2019-07-05
发明人： Sougo Ishioka , Masahiro Watanabe
CPC分类号： H05K1/023 , H05K9/0088 , H05K2201/0715
摘要： An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0.
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公开(公告)号：US11812543B2
公开(公告)日：2023-11-07
申请号：US16087698
申请日：2017-02-21
发明人： Akio Takahashi , Tsunehiko Terada
CPC分类号： H05K9/0083 , B32B27/18 , C09D5/24 , C09D7/61 , C09D7/69 , H05K1/023 , H05K1/0215 , H05K9/00 , H05K1/181 , H05K2201/0715
摘要： Provided is an electromagnetic wave shielding film capable of reducing a space formed between the electromagnetic wave shielding film and an electronic component on a wiring substrate and to increase an electromagnetic wave shielding effect. An electromagnetic wave shielding film 1 includes a conductive layer 3 having stretchability and a property of hardly returning to an original state thereof when once stretched, and an adhesion layer 4 formed on one surface of the conductive layer 3 and having insulating properties. The conductive layer 3 is made of a conductive composition, including a resin having stretchability and a property of hardly returning to an original state thereof when once stretched and a conductive filler filled with the resin. The resin has a tensile permanent set of 2.5% or more and 90% or less.
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公开(公告)号：US11647619B2
公开(公告)日：2023-05-09
申请号：US17781482
申请日：2020-12-01
IPC分类号： H05K9/00
CPC分类号： H05K9/0088 , H05K9/0094
摘要： Provided is an electromagnetic wave shielding film capable of easily adhering to an object, excellent in electrical connection stability, and excellent in transparency, shielding performance, and environmental resistance. The electromagnetic wave shielding film of the present invention has a first insulating layer, a transparent metal layer, a second insulating layer, and a conductive adhesive layer laminated in this order, in which a thickness of the second insulating layer is 10 to 500 nm, the conductive adhesive layer contains a binder component and spherical conductive particles, a median size of the spherical conductive particles is 3 to 50 μm, and a content ratio of the spherical conductive particles is 5 to 20 mass % with respect to 100 mass % of the conductive adhesive layer.
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8.发明授权公开(公告)号：US11497152B2
公开(公告)日：2022-11-08
申请号：US16929736
申请日：2020-07-15
发明人： Masahiro Watanabe
摘要： An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.
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公开(公告)号：US11490846B2
公开(公告)日：2022-11-08
申请号：US16311334
申请日：2017-06-23
摘要： A bioelectrode (1) includes: a main electrode film (3); a nonpolarizable electrode film (4) disposed on one surface of the main electrode film (3); and a conductive gel film (5) disposed on the opposite surface of the nonpolarizable electrode film (4) from the main electrode film. The nonpolarizable electrode film (4) is constituted by an electrode film that contains supported silver chloride, the supported silver chloride including (i) a support and (ii) silver chloride supported on the support.
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公开(公告)号：US11388847B2
公开(公告)日：2022-07-12
申请号：US16965427
申请日：2019-01-17
摘要： An electromagnetic wave shielding film includes an insulating protective layer, and a release film covering a surface of the insulating protective layer. The release film has a transmittance of 20-80% at a wavelength of 535 nm, a tight attachment confirmability index Ia of 11 or more, the tight attachment confirmability index Ia being represented by expression 1, and a presence visibility index Iv of 11 or more, the presence visibility index Iv being represented by expression 2. Ia=(ΔL*12+Δa*12+Δb*12)0.5 (expression 1) Iv=(ΔL*22+Δa*22+Δb*22)0.5 (expression 2)
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