Invention Grant
- Patent Title: Sputtering target for PVD chamber
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Application No.: US15679480Application Date: 2017-08-17
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Publication No.: US10060024B2Publication Date: 2018-08-28
- Inventor: Zhendong Liu , Rongjun Wang , Xianmin Tang , Srinivas Gandikota , Tza-Jing Gung , Muhammad M. Rasheed
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34
Abstract:
Target assemblies and PVD chambers including target assemblies are disclosed. The target assembly includes a target that has a concave shaped target. When used in a PVD chamber, the concave target provides more radially uniform deposition on a substrate disposed in the sputtering chamber.
Public/Granted literature
- US20170350001A1 Sputtering Target for PVD Chamber Public/Granted day:2017-12-07
Information query
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