Invention Grant
- Patent Title: Mounting device
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Application No.: US15509538Application Date: 2014-09-22
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Publication No.: US10071578B2Publication Date: 2018-09-11
- Inventor: Samrin Sing , Jeffrey G Bingham , Justin M Roman
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2014/056807 WO 20140922
- International Announcement: WO2016/048270 WO 20160331
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J25/34

Abstract:
Examples of a mounting device and method are disclosed herein. An example of the mounting device includes a carriage to hold a printhead assembly and an interconnect assembly to supply printing composition to the printhead assembly. The mounting device also includes a first latching assembly having an engaged condition to lock the interconnect assembly to a manifold of the printhead assembly and a disengaged condition to unlock the interconnect assembly from the manifold of the printhead assembly. The mounting device additionally includes a second latching assembly having an engaged condition to lock the printhead assembly to the carriage and a disengaged condition to unlock the printhead assembly from the carriage. In this example of the mounting device, the second latching assembly cannot be moved from the engaged condition to the disengaged condition unless the fast latching assembly is in the disengaged condition.
Public/Granted literature
- US20170282615A1 MOUNTING DEVICE Public/Granted day:2017-10-05
Information query
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