公开(公告)号：US10071578B2

公开(公告)日：2018-09-11

申请号：US15509538

申请日：2014-09-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Samrin Sing ,  Jeffrey G Bingham ,  Justin M Roman

IPC: B41J2/175 ,  B41J25/34

CPC classification number: B41J25/34 ,  B41J2/175 ,  B41J2/17523 ,  B41J2/17553 ,  B41J29/38

Abstract: Examples of a mounting device and method are disclosed herein. An example of the mounting device includes a carriage to hold a printhead assembly and an interconnect assembly to supply printing composition to the printhead assembly. The mounting device also includes a first latching assembly having an engaged condition to lock the interconnect assembly to a manifold of the printhead assembly and a disengaged condition to unlock the interconnect assembly from the manifold of the printhead assembly. The mounting device additionally includes a second latching assembly having an engaged condition to lock the printhead assembly to the carriage and a disengaged condition to unlock the printhead assembly from the carriage. In this example of the mounting device, the second latching assembly cannot be moved from the engaged condition to the disengaged condition unless the fast latching assembly is in the disengaged condition.

公开(公告)号：US20170282615A1

公开(公告)日：2017-10-05

申请号：US15509538

申请日：2014-09-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Samrin Sing ,  Jeffrey G Bingham ,  Justin M Roman

IPC: B41J25/34

CPC classification number: B41J25/34 ,  B41J2/175 ,  B41J2/17523 ,  B41J2/17553 ,  B41J29/38

Abstract: Examples of a mounting device and method are disclosed herein. An example of the mounting device includes a carriage to hold printhead assembly and an interconnect assembly to supply printing composition to the printhead assembly. The mounting device also includes a first latching assembly having an engaged condition to lock the interconnect assembly to a manifold of the printhead assembly and a disengaged condition to unlock the interconnect assembly from the manifold of the printhead assembly. The mounting device additionally includes a second latching assembly having an engaged condition to lock the printhead assembly to the carriage and a disengaged condition to unlock the printhead assembly from the carriage. In this example of the mounting device, the second latching assembly cannot be moved from the engaged condition to the disengaged condition unless the fast latching assembly is in the disengaged condition.

公开(公告)号：US11660808B2

公开(公告)日：2023-05-30

申请号：US16607919

申请日：2018-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David Soriano ,  Douglas Pederson ,  Nicola Baldo ,  Steve Ringwald ,  Samrin Sing ,  Matthew Baker

IPC: B29C64/153 ,  B33Y40/00 ,  B33Y50/00 ,  B29C64/386 ,  B29C64/35 ,  B22F12/50 ,  B22F12/90 ,  B22F10/30 ,  B33Y10/00 ,  B22F10/14 ,  B22F12/10

CPC classification number: B29C64/153 ,  B22F10/30 ,  B22F12/50 ,  B22F12/90 ,  B29C64/35 ,  B29C64/386 ,  B33Y40/00 ,  B33Y50/00 ,  B22F10/14 ,  B22F12/10 ,  B33Y10/00

Abstract: In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.

公开(公告)号：US20210402695A1

公开(公告)日：2021-12-30

申请号：US16607919

申请日：2018-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David Soriano ,  Douglas Pederson ,  Nicola Baldo ,  Steve Ringwald ,  Samrin Sing ,  Matthew Baker

IPC: B29C64/35 ,  B29C64/153 ,  B29C64/386 ,  B33Y40/00 ,  B33Y50/00

Abstract: In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.