Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
-
Application No.: US15267183Application Date: 2016-09-16
-
Publication No.: US10074542B2Publication Date: 2018-09-11
- Inventor: Akihiro Kubo , Teruhiko Kodama
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2015-190053 20150928
- Main IPC: B24B37/20
- IPC: B24B37/20 ; H01L21/304 ; H01L21/67 ; H01L21/02 ; H01L21/308
Abstract:
There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.
Public/Granted literature
- US20170092504A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2017-03-30
Information query
