Invention Grant
- Patent Title: Resistive memory and method for manufacturing the same
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Application No.: US15884827Application Date: 2018-01-31
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Publication No.: US10074692B2Publication Date: 2018-09-11
- Inventor: Wen-Hsin Hsu , Ko-Chi Chen , Tzu-Yun Chang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Priority: CN201611099421 20161202
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24 ; H01L23/528

Abstract:
A semiconductor structure includes a memory unit structure. The memory unit structure includes a transistor, a first electrode, two second electrode, and two resistive random access memory (RRAM) elements. The first electrode and the two second electrodes are disposed in a horizontal plane. The first electrode is disposed between the two second electrodes. The first electrode and the two second electrodes are disposed in parallel. The first electrode is coupled to a source region of the transistor. One of the two RRAM elements is disposed between the first electrode and one of the two second electrodes. The other one of the two RRAM elements is disposed between the first electrode and the other one of the two second electrodes.
Public/Granted literature
- US20180175110A1 RESISTIVE MEMORY AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-06-21
Information query
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