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公开(公告)号:US20240397712A1
公开(公告)日:2024-11-28
申请号:US18792499
申请日:2024-08-01
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hsueh-Chun Hsiao , Yi-Ning Peng , Tzu-Yun Chang
IPC: H10B41/30 , H01L21/28 , H01L29/423 , H01L29/66 , H01L29/78 , H01L29/788
Abstract: An array of programmable memory includes a first floating gate and a second floating gate disposed on a substrate along a first direction, two spacers disposed between and parallel to the first floating gate and the second floating gate, a first word line sandwiched by one of the spacers and the adjacent first floating gate, and a second word line sandwiched by the other one of the spacers and the adjacent second floating gate, and two first spacers disposed on the substrate, wherein one of the first spacer is disposed between the first word line and the first floating gate, and another spacer is disposed between the second word line and the second floating gate, wherein each spacer has substantially the same shape as each first spacer.
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公开(公告)号:US20230301083A1
公开(公告)日:2023-09-21
申请号:US18203054
申请日:2023-05-29
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hsueh-Chun Hsiao , Yi-Ning Peng , Tzu-Yun Chang
IPC: H10B41/30 , H01L29/423 , H01L29/78 , H01L29/66 , H01L21/28 , H01L29/788
CPC classification number: H10B41/30 , H01L29/42328 , H01L29/7833 , H01L29/66825 , H01L29/40114 , H01L29/66492 , H01L29/66545 , H01L29/7881
Abstract: An array of programmable memory includes a first floating gate and a second floating gate disposed on a substrate along a first direction, two spacers disposed between and parallel to the first floating gate and the second floating gate, a first word line sandwiched by one of the spacers and the adjacent first floating gate, and a second word line sandwiched by the other one of the spacers and the adjacent second floating gate, and two first spacers disposed on the substrate, wherein one of the first spacer is disposed between the first word line and the first floating gate, and another spacer is disposed between the second word line and the second floating gate, wherein each spacer has substantially the same shape as each first spacer.
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公开(公告)号:US09406771B1
公开(公告)日:2016-08-02
申请号:US14854161
申请日:2015-09-15
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Shih-Yin Hsiao , Hsueh-Chun Hsiao , Tzu-Yun Chang , Ching-Chung Yang
IPC: H01L29/78 , H01L29/49 , H01L29/423 , H01L29/08 , H01L29/06 , H01L21/28 , H01L21/265
CPC classification number: H01L29/4983 , H01L21/265 , H01L21/26513 , H01L21/28035 , H01L21/28105 , H01L29/0653 , H01L29/0847 , H01L29/42368 , H01L29/42372 , H01L29/4916 , H01L29/7833
Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate; a first and a second ion implantation regions of a first conductive type; a source and a drain diffusion regions formed in the first and the second ion implantation regions respectively; a channel diffusion region formed between the first and the second ion implantation regions; a gate layer disposed above the channel diffusion region and located between the source and the drain diffusion regions; and a third ion implantation region of a second conductive type formed in the gate layer, which extends in a first direction. The third ion implantation region is located above and covers two side portions of the channel diffusion region, the two side portions are adjacent to two edges, extending in a second direction perpendicular to the first direction, of the channel diffusion region.
Abstract translation: 提供半导体结构及其制造方法。 半导体结构包括基板; 第一导电类型的第一和第二离子注入区域; 在第一和第二离子注入区域中形成的源极和漏极扩散区域; 形成在第一和第二离子注入区之间的沟道扩散区; 栅极层,其设置在所述沟道扩散区域的上方且位于所述源极和漏极扩散区域之间; 以及形成在所述栅极层中的沿第一方向延伸的第二导电类型的第三离子注入区。 第三离子注入区域位于沟道扩散区域的上方并覆盖两个侧面部分,两个侧面部分与沟道扩散区域的垂直于第一方向的第二方向延伸的两个边缘相邻。
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公开(公告)号:US20220230689A1
公开(公告)日:2022-07-21
申请号:US17151226
申请日:2021-01-18
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Yi-Ning Peng , Hsueh-Chun Hsiao , Tzu-Yun Chang
IPC: G11C16/24 , G11C16/08 , H01L29/788 , H01L27/11556 , H01L27/11519
Abstract: An electrically erasable programmable read only memory (EEPROM) includes a substrate, bit lines, a row of erase gate and a row of floating gates. The bit lines are defined in the substrate to extend in a first direction. The row of erase gate having a wave shape is disposed across the bit lines. The row of floating gates having staggered islands is disposed parallel to the row of erase gate. A method of forming said electrically erasable programmable read only memory (EEPROM) is also provided.
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公开(公告)号:US20210242282A1
公开(公告)日:2021-08-05
申请号:US17235785
申请日:2021-04-20
Applicant: United Microelectronics Corp.
Inventor: Chung-Tse Chen , Ko-Chi Chen , Tzu-Yun Chang
Abstract: A method for fabricating memory device is provided. The method includes forming a transistor on a substrate. Further, a contact structure is formed on a source/drain region of the transistor. A conductive layer is formed on the contact structure. Four memory structures are formed on the conductive layer to form a quadrilateral structure.
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公开(公告)号:US11024672B2
公开(公告)日:2021-06-01
申请号:US16418770
申请日:2019-05-21
Applicant: United Microelectronics Corp.
Inventor: Chung-Tse Chen , Ko-Chi Chen , Tzu-Yun Chang
Abstract: A structure of memory device is provided. The structure of memory device includes a transistor formed on a substrate. A contact structure is disposed on a source/drain region of the transistor. A conductive layer is disposed on the contact structure. Four memory structures is disposed on the conductive layer to form a quadrilateral structure.
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公开(公告)号:US20200328255A1
公开(公告)日:2020-10-15
申请号:US16418770
申请日:2019-05-21
Applicant: United Microelectronics Corp.
Inventor: Chung-Tse Chen , Ko-Chi Chen , Tzu-Yun Chang
Abstract: A structure of memory device is provided. The structure of memory device includes a transistor formed on a substrate. A contact structure is disposed on a source/drain region of the transistor. A conductive layer is disposed on the contact structure. Four memory structures is disposed on the conductive layer to form a quadrilateral structure.
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公开(公告)号:US09923028B1
公开(公告)日:2018-03-20
申请号:US15402630
申请日:2017-01-10
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Wen-Hsin Hsu , Ko-Chi Chen , Tzu-Yun Chang
IPC: H01L45/00 , H01L27/24 , H01L23/528
CPC classification number: H01L27/2463 , H01L23/528 , H01L27/2436 , H01L45/08 , H01L45/1226 , H01L45/1246 , H01L45/1253 , H01L45/146 , H01L45/147 , H01L45/16 , H01L45/1608 , H05K999/99
Abstract: A semiconductor structure includes a memory unit structure. The memory unit structure includes a transistor, a first electrode, two second electrode, and two resistive random access memory (RRAM) elements. The first electrode and the two second electrodes are disposed in a horizontal plane. The first electrode is disposed between the two second electrodes. The first electrode and the two second electrodes are disposed in parallel. The first electrode is coupled to a source region of the transistor. One of the two RRAM elements is disposed between the first electrode and one of the two second electrodes. The other one of the two RRAM elements is disposed between the first electrode and the other one of the two second electrodes.
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公开(公告)号:US20170062279A1
公开(公告)日:2017-03-02
申请号:US14835700
申请日:2015-08-25
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Sih-Yun Wei , Hsueh-Chun Hsiao , Tzu-Yun Chang , Shih-Yin Hsiao , Ching-Chung Yang
IPC: H01L21/8238 , H01L21/266 , H01L27/092 , H01L29/66 , H01L21/265 , H01L29/167
CPC classification number: H01L21/823807 , H01L21/823814 , H01L27/0922 , H01L29/6659
Abstract: A transistor set forming process includes the following steps. A substrate having a first area and a second area is provided. An implantation process is performed to form a diffusion region of a first transistor in the substrate of the first area and a channel region of a second transistor in the substrate of the second area at the same time.
Abstract translation: 晶体管组形成工艺包括以下步骤。 提供具有第一区域和第二区域的衬底。 执行注入工艺,以在第一区域的衬底中的第一晶体管的扩散区域和第二区域的衬底中的第二晶体管的沟道区域同时形成。
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公开(公告)号:US20230033836A1
公开(公告)日:2023-02-02
申请号:US17960789
申请日:2022-10-05
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hsueh-Chun Hsiao , Yi-Ning Peng , Tzu-Yun Chang
IPC: H01L27/11521 , H01L29/66 , H01L21/28 , H01L29/423 , H01L29/788 , H01L29/78
Abstract: An array of electrically erasable programmable read only memory (EEPROM) includes a first row of floating gate, a second row of floating gate, two spacers, a first row of word line and a second row of word line. The first row of floating gate and the second row of floating gate are disposed on a substrate along a first direction. The two spacers are disposed between and parallel to the first row of floating gate and the second row of floating gate. The first row of word line is sandwiched by one of the spacers and the adjacent first row of floating gate, and the second row of word line is sandwiched by the other one of the spacers and the adjacent second row of floating gate. The present invention also provides a method of forming said array of electrically erasable programmable read only memory (EEPROM).
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