Invention Grant
- Patent Title: Fluid ejection device with fluid feed holes
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Application No.: US15545013Application Date: 2015-02-27
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Publication No.: US10076914B2Publication Date: 2018-09-18
- Inventor: Chien Hua Chen , Michael W Cumbie , Erik D Torniainen
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/017998 WO 20150227
- International Announcement: WO2016/137490 WO 20160901
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/19 ; B41J2/14
Abstract:
A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators.
Public/Granted literature
- US10112408B2 Fluid ejection device with fluid feed holes Public/Granted day:2018-10-30
Information query
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