公开(公告)号：US10076914B2

公开(公告)日：2018-09-18

申请号：US15545013

申请日：2015-02-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien Hua Chen ,  Michael W Cumbie ,  Erik D Torniainen

IPC: B41J2/16 ,  B41J2/19 ,  B41J2/14

Abstract: A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators.

公开(公告)号：US10328694B2

公开(公告)日：2019-06-25

申请号：US15556871

申请日：2015-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien Hua Chen ,  Diane R Hammerstad ,  Randy Hoffman

IPC: B41J2/14 ,  B41J2/16

Abstract: A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.

公开(公告)号：US20180170050A1

公开(公告)日：2018-06-21

申请号：US15556871

申请日：2015-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien Hua Chen ,  Diane R Hammerstad ,  Randy Hoffman

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14072 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/13 ,  B41J2202/18

Abstract: A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.

公开(公告)号：US10112408B2

公开(公告)日：2018-10-30

申请号：US15545013

申请日：2015-02-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien Hua Chen ,  Michael W Cumbie ,  Erik D Torniainen

IPC: B41J2/16 ,  B41J2/19 ,  B41J2/14

Abstract: A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators.

公开(公告)号：US20180015732A1

公开(公告)日：2018-01-18

申请号：US15545013

申请日：2015-02-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien Hua Chen ,  Michael W Cumbie ,  Erik D Torniainen

IPC: B41J2/19 ,  B41J2/14 ,  B41J2/16

CPC classification number: B41J2/19 ,  B41J2/1404 ,  B41J2/14201 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1626 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1637 ,  B41J2002/14403 ,  B41J2002/14419

Abstract: A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators.