Invention Grant
- Patent Title: Method for producing a semiconductor package
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Application No.: US15884979Application Date: 2018-01-31
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Publication No.: US10079161B2Publication Date: 2018-09-18
- Inventor: Toshiyuki Inaoka , Yuichiro Yoshikawa , Atsuhiro Uratsuji , Katsushi Yoshimitsu
- Applicant: J-Devices Corporation
- Applicant Address: JP Usuki-shi, Oita
- Assignee: J-DEVICES CORPORATION
- Current Assignee: J-DEVICES CORPORATION
- Current Assignee Address: JP Usuki-shi, Oita
- Agency: Flynn Thiel, P.C.
- Priority: JP2016-127753 20160628
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L23/538 ; H01L21/56 ; H01L23/367
Abstract:
An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide a thin semiconductor package with which a final product includes no support flat plate. To realize this, a semiconductor package having a structure wherein semiconductor chips are accommodated in cavity parts of a support which is formed by copper plating and includes the cavity parts is provided.
Public/Granted literature
- US20180174975A1 SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME Public/Granted day:2018-06-21
Information query
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