Invention Grant
- Patent Title: Power management in multi-die assemblies
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Application No.: US15206999Application Date: 2016-07-11
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Publication No.: US10079489B2Publication Date: 2018-09-18
- Inventor: Guido Droege , Andre Schaefer , Uwe Zillmann
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: H02J1/00
- IPC: H02J1/00 ; G11C7/00 ; H02M1/088 ; G11C5/14 ; G11C5/02 ; G05F1/618

Abstract:
An apparatus such as heterogeneous device includes at least a first die and a second die. The apparatus further includes a first inductive element, a second inductive element, and switch control circuitry. The switch control circuitry is disposed in the first die. The switch control circuitry controls current through the first inductive element to produce a first voltage. The first voltage powers the first die. The second inductive element is coupled to the first inductive element. The second inductive element produces a second voltage to power the second die. The first die and second die can be fabricated in accordance with different technologies and in which the first die and second die withstand different maximum voltages. A magnitude of the first voltage can be greater than a magnitude of the second voltage.
Public/Granted literature
- US20170011779A1 POWER MANAGEMENT IN MULTI-DIE ASSEMBLIES Public/Granted day:2017-01-12
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