Logic circuit block layouts with dual-side processing
Abstract:
An integrated circuit device may include a p-type metal oxide semiconductor (PMOS) transistor supported by a backside of an isolation layer. The integrated circuit device may also include an n-type metal oxide semiconductor (NMOS) transistor supported by a front-side of the isolation layer, opposite the backside. The integrated circuit device may further include a shared contact extending through the isolation layer and electrically coupling a first terminal of the PMOS transistor to the first terminal of the NMOS transistor.
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