Invention Grant
- Patent Title: Method for separating at least two substrates along a selected interface
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Application No.: US15256265Application Date: 2016-09-02
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Publication No.: US10093086B2Publication Date: 2018-10-09
- Inventor: Didier Landru , Christophe Figuet
- Applicant: Soitec
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Priority: FR1258403 20120907
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/67 ; B32B43/00 ; H01L21/20 ; H01L21/683

Abstract:
A process for separating at least two substrates comprising at least two separation interfaces along one of the interfaces includes, before inserting a blade between the substrate, damaging at least one portion of a peripheral region of a chosen one of the interfaces, then inserting the blade and partially parting the substrates, and applying a fluid in a space between the parted substrates while the blade remains inserted therebetween, and decreasing a rupture energy of the chosen interface by stress corrosion involving breaking of siloxane bonds present at the interface.
Public/Granted literature
- US20160368259A1 METHOD FOR SEPARATING AT LEAST TWO SUBSTRATES ALONG A SELECTED INTERFACE Public/Granted day:2016-12-22
Information query
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