- 专利标题： Method of manufacturing multilayer body, method of processing substrate, and multilayer body
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申请号： US14127315申请日： 2012-05-31
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公开(公告)号： US10094024B2公开(公告)日： 2018-10-09
- 发明人: Yasushi Fujii , Tatsuhiro Mitake , Atsushi Matsushita
- 申请人： Yasushi Fujii , Tatsuhiro Mitake , Atsushi Matsushita
- 申请人地址： JP Kawasaki-Shi
- 专利权人： TOKYO OHKA KOGYO CO., LTD.
- 当前专利权人： TOKYO OHKA KOGYO CO., LTD.
- 当前专利权人地址： JP Kawasaki-Shi
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： JP2011-141267 20110624
- 国际申请： PCT/JP2012/064239 WO 20120531
- 国际公布： WO2012/176607 WO 20121227
- 主分类号： C23C16/50
- IPC分类号： C23C16/50 ; H01L21/02 ; H01L21/683 ; C23C16/26 ; C23C16/505
摘要：
A method for forming a release layer which lies between a substrate and a supporting member and has a property that changes when the release layer absorbs light coming through the supporting member, by carrying out plasma CVD with a high-frequency power that is set so as to be higher than a power at which a mode jump occurs.