Invention Grant
- Patent Title: Method of fabricating a packaging substrate including a carrier having two carrying portions
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Application No.: US14755372Application Date: 2015-06-30
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Publication No.: US10096491B2Publication Date: 2018-10-09
- Inventor: Yu-Cheng Pai , Chun-Hsien Lin , Wei-Chung Hsiao , Ming-Chen Sun , Liang-Yi Hung
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Silicon Precision Industries Co., Ltd.
- Current Assignee: Silicon Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW101130038A 20120822
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L21/78 ; H01L23/00 ; H01L23/498 ; H01L23/31
Abstract:
A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement.
Public/Granted literature
- US20150303073A1 METHOD OF FABRICATING A PACKAGING SUBSTRATE Public/Granted day:2015-10-22
Information query
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