公开(公告)号：US09607923B2

公开(公告)日：2017-03-28

申请号：US14998048

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chung-Jen Hung ,  Chi-An Pan ,  Chi-Hsiang Hsu ,  Liang-Yi Hung

IPC: H01L23/367 ,  H01L23/373 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/3157 ,  H01L23/3736 ,  H01L23/433 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2745 ,  H01L2224/29005 ,  H01L2224/29082 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/00

Abstract: An electronic device is provided, which includes an electronic element and a heat dissipating element disposed on the electronic element through a thermal conductor, wherein a width of the thermal conductor is smaller than a width of the electronic element. The thermal conductor includes silver to thereby greatly increase the thermal conductivity of the thermal conductor and hence improve the thermal conduction efficiency of the electronic device.

公开(公告)号：US20150028485A1

公开(公告)日：2015-01-29

申请号：US13950638

申请日：2013-07-25

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Liang-Yi Hung ,  Shih-Chao Chih ,  Yu-Cheng Pai ,  Wei-Chung Hsiao

IPC: H01L23/48

CPC classification number: H01L23/498 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81447 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A substrate structure is provided. The substrate structure includes a substrate body; a metal layer formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having at least an opening for exposing the metal layer; and at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon. The die attach area covers the entire opening or the metal layer is formed within the die attach area, thereby effectively preventing package delamination and improving the product yield.

Abstract translation: 提供了基板结构。 衬底结构包括衬底本体; 形成在所述基板主体的表面上的金属层; 绝缘层，其形成在所述基板主体的表面上，并且至少具有用于使所述金属层露出的开口; 以及至少一个限定在基板主体的表面上的芯片附着区域，其对应于要布置在其上的半导体芯片的开口的位置。 芯片附着区域覆盖整个开口，或者在芯片附着区域内形成金属层，从而有效地防止封装分层并提高产品产量。

公开(公告)号：US10096491B2

公开(公告)日：2018-10-09

申请号：US14755372

申请日：2015-06-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Cheng Pai ,  Chun-Hsien Lin ,  Wei-Chung Hsiao ,  Ming-Chen Sun ,  Liang-Yi Hung

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

Abstract: A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement.

公开(公告)号：US09542598B2

公开(公告)日：2017-01-10

申请号：US14631892

申请日：2015-02-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Yu Teng ,  Liang-Yi Hung

IPC: G06K9/00 ,  H01L23/00 ,  H01L23/29 ,  H01L21/78 ,  H01L21/56

CPC classification number: G06K9/0053 ,  G06K9/0002 ,  G06K9/0004 ,  H01L21/561 ,  H01L21/566 ,  H01L21/78 ,  H01L23/295 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.

Abstract translation: 提供了一种制造封装结构的方法，包括以下步骤：将感测芯片布置并电连接到基板; 在衬底上形成密封剂以封装感测芯片; 并在密封剂上形成光亮层以增加封装结构的光泽度。 密封剂包括添加剂以增加密封剂的莫氏硬度。 此外，具有不同添加剂的密封剂呈现不同的颜色。 因此，本发明获得了高光泽，高硬度和彩色的传感器封装结构。

公开(公告)号：US20160329261A1

公开(公告)日：2016-11-10

申请号：US14998048

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chung-Jen Hung ,  Chi-An Pan ,  Chi-Hsiang Hsu ,  Liang-Yi Hung

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56

CPC classification number: H01L23/3675 ,  H01L23/3157 ,  H01L23/3736 ,  H01L23/433 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2745 ,  H01L2224/29005 ,  H01L2224/29082 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/00

Abstract: An electronic device is provided, which includes an electronic element and a heat dissipating element disposed on the electronic element through a thermal conductor, wherein a width of the thermal conductor is smaller than a width of the electronic element. The thermal conductor includes silver to thereby greatly increase the thermal conductivity of the thermal conductor and hence improve the thermal conduction efficiency of the electronic device.

Abstract translation: 提供了一种电子设备，其包括通过热导体设置在电子元件上的电子元件和散热元件，其中导热体的宽度小于电子元件的宽度。 热导体包括银，从而大大增加导热体的导热性，从而提高电子器件的热传导效率。

公开(公告)号：US20150303073A1

公开(公告)日：2015-10-22

申请号：US14755372

申请日：2015-06-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Cheng Pai ,  Chun-Hsien Lin ,  Wei-Chung Hsiao ,  Ming-Chen Sun ,  Liang-Yi Hung

IPC: H01L21/48 ,  H01L23/498 ,  H01L21/683

CPC classification number: H01L21/4857 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement.

Abstract translation: 提供了一种制造封装基板的方法，包括：提供具有两个承载部分的载体，每个承载部分具有第一侧和与第一侧相对的第二侧，并且承载部分通过其第二侧接合; 在每个所述承载部分的第一侧上形成电路层; 并将两个承载部分彼此分离以形成两个包装基板。 承载部分有助于电路层的薄化，并为包装基材提供足够的强度以经历后续包装过程。 可以在包装过程之后移除承载部分以减小包装的厚度，从而满足小型化要求。

公开(公告)号：US20140057410A1

公开(公告)日：2014-02-27

申请号：US13682134

申请日：2012-11-20

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Cheng Pai ,  Chun-Hsien Lin ,  Wei-Chung Hsiao ,  Ming-Chen Sun ,  Liang-Yi Hung

IPC: H01L21/78

CPC classification number: H01L21/4857 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement.

Abstract translation: 提供了一种制造封装基板的方法，包括：提供具有两个承载部分的载体，每个承载部分具有第一侧和与第一侧相对的第二侧，并且承载部分通过其第二侧接合; 在每个所述承载部分的第一侧上形成电路层; 并将两个承载部分彼此分离以形成两个包装基板。 承载部分有助于电路层的薄化，并为包装基材提供足够的强度以经历后续包装过程。 可以在包装过程之后移除承载部分以减小包装的厚度，从而满足小型化要求。

公开(公告)号：US20160172264A1

公开(公告)日：2016-06-16

申请号：US14631892

申请日：2015-02-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Yu Teng ,  Liang-Yi Hung

IPC: H01L23/31 ,  H01L21/56 ,  G06K9/00 ,  H01L23/495 ,  H01L23/00 ,  H01L23/29 ,  H01L21/78

CPC classification number: G06K9/0053 ,  G06K9/0002 ,  G06K9/0004 ,  H01L21/561 ,  H01L21/566 ,  H01L21/78 ,  H01L23/295 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.

Abstract translation: 提供了一种制造封装结构的方法，包括以下步骤：将感测芯片布置并电连接到基板; 在衬底上形成密封剂以封装感测芯片; 并在密封剂上形成光亮层以增加封装结构的光泽度。 密封剂包括添加剂以增加密封剂的莫氏硬度。 此外，具有不同添加剂的密封剂呈现不同的颜色。 因此，本发明获得了高光泽，高硬度和彩色的传感器封装结构。