Invention Grant
- Patent Title: Tiled-stress-alleviating pad structure
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Application No.: US15791568Application Date: 2017-10-24
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Publication No.: US10096557B2Publication Date: 2018-10-09
- Inventor: Ekta Misra , Mukta G. Farooq , Krishna Tunga
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Scully Scott Murphy and Presser
- Agent Frank Digiglio
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/528 ; H01L21/3205
Abstract:
Structure and method for reducing thermal-mechanical stresses generated for a semiconductor device are provided, which includes a tiled-stress-alleviating pad structure.
Public/Granted literature
- US20180061777A1 TILED-STRESS-ALLEVIATING PAD STRUCTURE Public/Granted day:2018-03-01
Information query
IPC分类:
