Invention Grant
- Patent Title: Modular structural and functional subassemblies
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Application No.: US14020676Application Date: 2013-09-06
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Publication No.: US10103423B2Publication Date: 2018-10-16
- Inventor: Daniel W. Jarvis , Richard Hung Minh Dinh , Miguel C. Christophy , Hao Xu , Jayesh Nath , Jared M. Kole , Mattia Pascolini , Ruben Caballero , Jennifer M. Edwards , Peter I. Bevelacqua , Robert W. Schlub
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agent Michael H. Lyons
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; G06F1/16 ; H04M1/02 ; H04M1/18

Abstract:
A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing.
Public/Granted literature
- US20140361935A1 MODULAR STRUCTURAL AND FUNCTIONAL SUBASSEMBLIES Public/Granted day:2014-12-11
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