User equipment codebook memory
    1.
    发明授权

    公开(公告)号:US12237891B2

    公开(公告)日:2025-02-25

    申请号:US17878799

    申请日:2022-08-01

    Applicant: Apple Inc.

    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for storing a codebook in an integrated circuit. One of the methods includes storing, for an integrated circuit that comprises a memory, first data for a codebook in the memory; determining second data for the codebook using the first data; and sending, over a bus, the second data for the codebook to an antenna module separate from the integrated circuit.

    Electronic Devices Having Tilted Antenna Arrays

    公开(公告)号:US20230178899A1

    公开(公告)日:2023-06-08

    申请号:US17541699

    申请日:2021-12-03

    Applicant: Apple Inc.

    CPC classification number: H01Q21/0075 H01Q1/2283 H01Q1/243

    Abstract: An electronic device may be provided with first and second sidewalls, a rear wall, and a display. Multiple antenna panels may be used to convey radio-frequency signals at frequencies greater than 10 GHz. A first antenna panel may radiate through the display while second and third panels radiate through the first and second sidewalls. The second and third panels may be tilted at non-zero angles with respect to the sidewalls. The non-zero angles may be of opposite sign. The non-zero angles may have the same magnitude. The magnitude may be equal to 15 degrees, as one example. Tilting the panels in this way may allow the panels to collectively cover as much of a sphere around the device as possible, including out of coverage areas behind the rear wall caused by conductive material in the rear wall, without requiring additional panels to be disposed within the device.

    Millimeter wave impedance matching structures

    公开(公告)号:US11289802B2

    公开(公告)日:2022-03-29

    申请号:US16413508

    申请日:2019-05-15

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a transceiver, a substrate, and antennas mounted to the substrate. The transceiver and antennas may convey signals between 10 GHz and 300 GHz. A radio-frequency connector may be mounted to the substrate. A coaxial cable may couple the transceiver to the connector. A stripline in the substrate may couple the connector to the antennas. Impedance matching structures may be embedded in the substrate for matching an impedance of the stripline to an impedance of the coaxial cable. The impedance matching structures may include a fence of conductive vias, landing pads, and a volume of the dielectric substrate defined by the fence of conductive vias and the landing pads. The impedance matching structures may be configured to perform impedance matching over a relatively wide bandwidth that includes the frequency band of operation for the antennas.

    Electronic Devices Having Dielectric Resonator Antennas with Parasitic Patches

    公开(公告)号:US20210328351A1

    公开(公告)日:2021-10-21

    申请号:US16851848

    申请日:2020-04-17

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a probe-fed dielectric resonator antenna that radiates through the cover layer. The antenna may include a dielectric resonating element that is excited by one or two feed probes. One or more floating parasitic elements and/or grounded parasitic elements may be patterned onto the dielectric resonating element. The parasitic elements may create boundary conditions on the dielectric resonating element that serve to isolate the antenna from cross polarization interference.

    Millimeter wave antennas having continuously stacked radiating elements

    公开(公告)号:US11121469B2

    公开(公告)日:2021-09-14

    申请号:US16584067

    申请日:2019-09-26

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a phased antenna array. The array may convey signals greater than 10 GHz and may be formed on a substrate having transmission line layers and antenna layers. An antenna in the array may have a radiating element that includes first, second, and third overlapping patch elements on the antenna layers. The antenna may be fed using a differential transmission line coupled to a differential feed on the first patch element. The differential transmission line may include first and second signal traces. A first via may couple the first signal trace to the first, second, and third patch elements. A second via may couple the second signal trace to the first, second, and third patch elements. The patch elements may introduce capacitances to the radiating element that help to compensate for inductances associated with the distance between the radiating element and the signal traces.

    Integrated Millimeter Wave Antenna Modules

    公开(公告)号:US20210075088A1

    公开(公告)日:2021-03-11

    申请号:US16990879

    申请日:2020-08-11

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

    Millimeter Wave Impedance Matching Structures

    公开(公告)号:US20200321690A1

    公开(公告)日:2020-10-08

    申请号:US16413508

    申请日:2019-05-15

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a transceiver, a substrate, and antennas mounted to the substrate. The transceiver and antennas may convey signals between 10 GHz and 300 GHz. A radio-frequency connector may be mounted to the substrate. A coaxial cable may couple the transceiver to the connector. A stripline in the substrate may couple the connector to the antennas. Impedance matching structures may be embedded in the substrate for matching an impedance of the stripline to an impedance of the coaxial cable. The impedance matching structures may include a fence of conductive vias, landing pads, and a volume of the dielectric substrate defined by the fence of conductive vias and the landing pads. The impedance matching structures may be configured to perform impedance matching over a relatively wide bandwidth that includes the frequency band of operation for the antennas.

    Antenna Arrays Having Conductive Shielding Buckets

    公开(公告)号:US20190267718A1

    公开(公告)日:2019-08-29

    申请号:US15906979

    申请日:2018-02-27

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a sidewall, a display module separated from the sidewall by a gap a display cover, a conductive bucket mounted to the display cover within the gap, and a phased antenna array mounted to the bucket for conveying millimeter wave signals through the display cover. The sidewall may form part of an antenna for conveying non-millimeter wave signals. The array may include resonating elements on a substrate. The resonating elements may be fed using feed terminals coupled to alternating sides of the resonating elements. Dielectric layers having a dielectric constant lower than that of the display cover may be provided on a surface of the display cover within the bucket. The array may operate with satisfactory efficiency despite the small amount of available space within the device, electromagnetic interference from the sidewall and the display module, and dielectric loading by the display cover.

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