- 专利标题： Microrelief structural body, decorative sheet, decorative resin molded body, method for producing microrelief structural body, and method for producing decorative resin molded body
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申请号： US14780698申请日： 2014-04-04
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公开(公告)号： US10137661B2公开(公告)日： 2018-11-27
- 发明人: Tsuyoshi Takihara , Eiko Okamoto
- 申请人： Mitsubishi Rayon Co., Ltd.
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Chemical Corporation
- 当前专利权人： Mitsubishi Chemical Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Morgan, Lewis & Bockius LLP
- 优先权： JP2013-079743 20130405; JP2014-031730 20140221
- 国际申请： PCT/JP2014/059965 WO 20140404
- 国际公布： WO2014/163185 WO 20141009
- 主分类号： B32B3/30
- IPC分类号： B32B3/30 ; B32B27/06 ; B32B27/08 ; B32B27/30 ; B29C33/42 ; B29C45/16 ; B29C51/02 ; B29C37/00 ; G02B1/118 ; B32B27/36 ; B29C45/14 ; B29L31/00 ; B29C51/14 ; B29K33/04 ; B29K69/00 ; B29K105/00
摘要：
A structural body which comprises a base and a microrelief structure layer having a microrelief structure. The microrelief structure layer is laminated on the base so as to form the surface layer of this structural body, and the microrelief structure layer has at least one physical property selected from the group consisting of (A) and (B) described below. (A) The elastic modulus at 25° C. is 50 MPa or more, and the elastic modulus at 80° C. is 30 MPa or less. (B) The tensile elongation at break at 80° C. is from 20% to 100% (inclusive).
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