Invention Grant
- Patent Title: Process for forming semiconductor layers of different thickness in FDSOI technologies
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Application No.: US15279559Application Date: 2016-09-29
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Publication No.: US10141229B2Publication Date: 2018-11-27
- Inventor: Jürgen Faul , Thorsten Kammler
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/092 ; H01L21/762 ; H01L21/84 ; H01L21/28 ; H01L21/8234

Abstract:
In fully depleted SOI transistors, specifically designed semiconductor materials may be provided for different types of transistors, thereby, for instance, enabling a reduction of hot carrier injection in transistors that are required to be operated at a moderately high operating voltage. To this end, well-controllable epitaxial growth techniques may be applied selectively for one type of transistor, while not unduly affecting the adjustment of material characteristics of a different type of transistor.
Public/Granted literature
- US20180090386A1 PROCESS FOR FORMING SEMICONDUCTOR LAYERS OF DIFFERENT THICKNESS IN FDSOI TECHNOLOGIES Public/Granted day:2018-03-29
Information query
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