- 专利标题: Bent-bridge semiconductive apparatus
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申请号: US15394388申请日: 2016-12-29
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公开(公告)号: US10141265B2公开(公告)日: 2018-11-27
- 发明人: Bernd Waidhas , Stephan Stoeckl , Andreas Wolter , Reinhard Mahnkopf , Georg Seidemann , Thomas Wagner , Laurent Millou
- 申请人: Intel IP Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel IP Corporation
- 当前专利权人: Intel IP Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 主分类号: H01L23/06
- IPC分类号: H01L23/06 ; H01L23/538 ; H01L25/065 ; H01L23/00 ; H01L21/48 ; H01L23/053
摘要:
A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of planarity. The silicon bridge may couple two semiconductive devices, all of which are from an integral processed die.
公开/授权文献
- US20180190589A1 BENT-BRIDGE SEMICONDUCTIVE APPARATUS 公开/授权日:2018-07-05