Invention Grant
- Patent Title: Method and apparatus for packet communication using header compression
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Application No.: US15200455Application Date: 2016-07-01
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Publication No.: US10142206B2Publication Date: 2018-11-27
- Inventor: Hyeun-Mok Jung , Praveen Chebolu , Shaik Abdulla , Varun Bharadwaj , Ganesh Babu Kamma , Jai-Dong Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2015-0095171 20150703
- Main IPC: H04W4/00
- IPC: H04W4/00 ; H04L12/26 ; H04L29/06 ; H04L1/16 ; H04W84/04 ; H04W84/12 ; H04J13/00 ; H04W4/80
Abstract:
Disclosed are a method and apparatus for packet communication using header compression. The method includes applying a header compression protocol to generate a packet to be transmitted, determining whether the packet is dropped in a transport layer, and transmitting, if it is determined that the packet is dropped, a full packet having an uncompressed header.
Public/Granted literature
- US20170006496A1 METHOD AND APPARATUS FOR PACKET COMMUNICATION USING HEADER COMPRESSION Public/Granted day:2017-01-05
Information query
