- 专利标题: Method for producing transparent conductive film
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申请号: US15126267申请日: 2015-02-27
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公开(公告)号: US10151024B2公开(公告)日: 2018-12-11
- 发明人: Hiroaki Ueda
- 申请人: KANEKA CORPORATION
- 申请人地址: JP Osaka-Shi, Osaka
- 专利权人: KANEKA CORPORATION
- 当前专利权人: KANEKA CORPORATION
- 当前专利权人地址: JP Osaka-Shi, Osaka
- 代理机构: Alleman Hall Creasman & Tuttle LLP
- 优先权: JP2014-074531 20140331
- 国际申请: PCT/JP2015/055973 WO 20150227
- 国际公布: WO2015/151687 WO 20151008
- 主分类号: C23C14/34
- IPC分类号: C23C14/34 ; C23C14/08 ; C23C14/56 ; C23C14/58
摘要:
For use in a method for producing a transparent conductive film having an ITO transparent electrode layer, a roll-to-roll sputtering apparatus includes at least three deposition chambers adjacent to a deposition roll. While a transparent film substrate is conveyed on the deposition roll, a base conductive layer is formed by sputtering deposition in one or more deposition chambers, and a main conductive layer is formed thereon by successive sputtering deposition in two or more film deposition chambers. The applied power in the deposition chambers where the underlying conductive layer is formed is 5% to 20% of the total of the applied power in each the deposition chamber where the underlying or main conductive layer is formed. In formation of the main conductive layer, the applied power in the deposition chamber where the ITO thin film is first deposited is less than the applied power in the next deposition chamber.
公开/授权文献
- US20170088938A1 METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE FILM 公开/授权日:2017-03-30
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