Invention Grant
- Patent Title: Microphone assembly and method of manufacturing a microphone assembly
-
Application No.: US15306928Application Date: 2014-05-12
-
Publication No.: US10165342B2Publication Date: 2018-12-25
- Inventor: Gino Rocca
- Applicant: EPCOS AG
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- International Application: PCT/EP2014/059648 WO 20140512
- International Announcement: WO2015/172809 WO 20151119
- Main IPC: H04R1/04
- IPC: H04R1/04 ; H03F3/45 ; H04R19/04 ; H03F3/183 ; H03G3/30 ; H04R19/00
Abstract:
A microphone assembly and a method for manufacturing a microphone assembly are disclosed. In an embodiment, the microphone assembly includes a MEMS dual backplate microphone configured to provide a differential output signal, an ASIC including a differential amplifier configured to receive the differential output signal and a control element configured to adjust at least one of a setting of the MEMS dual backplate microphone and a setting of the ASIC.
Public/Granted literature
- US20170055056A1 Microphone Assembly and Method of Manufacturing a Microphone Assembly Public/Granted day:2017-02-23
Information query
