Invention Grant
- Patent Title: Joint assembly and method of forming thereof
-
Application No.: US13926377Application Date: 2013-06-25
-
Publication No.: US10167075B2Publication Date: 2019-01-01
- Inventor: Dennis K. Kennedy , Zach K. Stahlecker , Saul Opie
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Armstrong Teasdale LLP
- Main IPC: B64C11/26
- IPC: B64C11/26 ; F16B11/00 ; B64C27/473

Abstract:
A joint assembly includes a first component formed from a first material and a second component including a portion that extends at least partially into the first component and that has an uneven outer profile. The first material is configured to form the first component into a shape that is substantially complementary to a shape of the portion to facilitate restricting movement of the second component in an axial direction.
Public/Granted literature
- US20140377076A1 JOINT ASSEMBLY AND METHOD OF FORMING THEREOF Public/Granted day:2014-12-25
Information query