Invention Grant
- Patent Title: Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof
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Application No.: US15652999Application Date: 2017-07-18
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Publication No.: US10170242B2Publication Date: 2019-01-01
- Inventor: Jin Hwan Kim , Dae Bok Oh , Jae Young Park , Ichiro Tanaka , Chang Ho Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0063094 20140526
- Main IPC: H01G2/14
- IPC: H01G2/14 ; H01G4/012 ; H01G4/248 ; H01G4/40 ; H05K1/18 ; H01G2/06 ; H01G2/22 ; H01G4/12 ; H01G4/30 ; H05K1/02 ; H05K3/34

Abstract:
A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.
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