Array type chip resistor and method of manufacturing thereof
    1.
    发明授权
    Array type chip resistor and method of manufacturing thereof 有权
    阵列型片式电阻器及其制造方法

    公开(公告)号:US08987864B2

    公开(公告)日:2015-03-24

    申请号:US14018801

    申请日:2013-09-05

    IPC分类号: H01L29/00 H01L49/02

    摘要: There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.

    摘要翻译: 提供了一种阵列式芯片电阻器,包括:芯片体,设置在芯片体的下表面的两侧的四对下电极,并且形成为延伸到芯片主体的边缘,形成为使得 下部电极延伸到芯片主体的侧面,并且电阻器插入在芯片主体的下表面上的下部电极之间,并通过接触部分电连接到下部电极,其中当限定侧面电极的宽度时 作为d1,将相邻的侧面电极之间的距离定义为d2,将侧面电极的高度定义为h,在d1 / d2为0.5〜1.5的情况下,h的值为4300 /d1μm以上 为0.24d2 +87.26μm以下。

    Electronic component and manufacturing method thereof

    公开(公告)号:US10861625B2

    公开(公告)日:2020-12-08

    申请号:US16299721

    申请日:2019-03-12

    摘要: An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20200090842A1

    公开(公告)日:2020-03-19

    申请号:US16299721

    申请日:2019-03-12

    摘要: An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.