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公开(公告)号:US08987864B2
公开(公告)日:2015-03-24
申请号:US14018801
申请日:2013-09-05
发明人: Jung Il Kim , Ha Sung Hwang , Hae In Kim , Ichiro Tanaka , Oh Sung Kwon
摘要: There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.
摘要翻译: 提供了一种阵列式芯片电阻器,包括:芯片体,设置在芯片体的下表面的两侧的四对下电极,并且形成为延伸到芯片主体的边缘,形成为使得 下部电极延伸到芯片主体的侧面,并且电阻器插入在芯片主体的下表面上的下部电极之间,并通过接触部分电连接到下部电极,其中当限定侧面电极的宽度时 作为d1,将相邻的侧面电极之间的距离定义为d2,将侧面电极的高度定义为h,在d1 / d2为0.5〜1.5的情况下,h的值为4300 /d1μm以上 为0.24d2 +87.26μm以下。
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公开(公告)号:US10861625B2
公开(公告)日:2020-12-08
申请号:US16299721
申请日:2019-03-12
发明人: Jong Pil Lee , Ichiro Tanaka , Doo Ho Yoo , Hyun Jun Choi , Hyung Gon Kim , Hyung Seok Roh , Jung Il Kim
摘要: An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.
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公开(公告)号:US08994491B2
公开(公告)日:2015-03-31
申请号:US13716982
申请日:2012-12-17
发明人: Yong Min Kim , Jung Il Kim , Ichiro Tanaka , Young Tae Kim , Heun Ku Kang
IPC分类号: H01C1/012 , H01C7/00 , H01C17/00 , H01C17/065
CPC分类号: H01C7/00 , H01C7/003 , H01C17/006 , H01C17/065 , H01C17/06526 , Y10T29/49082
摘要: There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
摘要翻译: 提供了片式电阻器及其制造方法。 芯片电阻器包括陶瓷基板; 形成在所述陶瓷基板的表面上的粘合部; 和形成在粘接部分上的电阻器,其中粘合部分包括铜(Cu),镍(Ni)和铜 - 镍(Cu-Ni)中的至少一种。
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公开(公告)号:US10770226B2
公开(公告)日:2020-09-08
申请号:US16200468
申请日:2018-11-26
发明人: Jin Hwan Kim , Dae Bok Oh , Jae Young Park , Ichiro Tanaka , Chang Ho Lee
IPC分类号: H01G2/14 , H01G4/012 , H01G4/248 , H01G4/40 , H05K1/18 , H01G2/06 , H01G2/22 , H01G4/12 , H01G4/30 , H05K1/02 , H05K3/34
摘要: A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.
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公开(公告)号:US20200090842A1
公开(公告)日:2020-03-19
申请号:US16299721
申请日:2019-03-12
发明人: Jong Pil Lee , Ichiro Tanaka , Doo Ho Yoo , Hyun Jun Choi , Hyung Gon Kim , Hyung Seok Roh , Jung Il Kim
摘要: An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.
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公开(公告)号:US10170242B2
公开(公告)日:2019-01-01
申请号:US15652999
申请日:2017-07-18
发明人: Jin Hwan Kim , Dae Bok Oh , Jae Young Park , Ichiro Tanaka , Chang Ho Lee
IPC分类号: H01G2/14 , H01G4/012 , H01G4/248 , H01G4/40 , H05K1/18 , H01G2/06 , H01G2/22 , H01G4/12 , H01G4/30 , H05K1/02 , H05K3/34
摘要: A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.
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