Invention Grant
- Patent Title: Methods of post-process dispensation of plasma induced damage protection component
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Application No.: US14517605Application Date: 2014-10-17
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Publication No.: US10181713B2Publication Date: 2019-01-15
- Inventor: Arnaud Bousquet , Geetha Sai Aluri , Suresh Uppal
- Applicant: GlobalFoundries, Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Williams Morgan, P.C.
- Main IPC: H02H3/08
- IPC: H02H3/08 ; H01L21/66 ; H01L21/8234 ; H01L23/525 ; H01L27/02 ; H01L29/66 ; H01L29/78 ; H01L49/02
Abstract:
At least one method, apparatus and system disclosed herein involves providing an integrated circuit device comprising a protection circuit. And integrated circuit device is formed. A protection component is formed in parallel to the integrated circuit device. The protection component is configured for protecting the integrated circuit device from a portion of a charge. A circuit break device in series to the protection component, wherein the protection component and the circuit break device are in parallel to the integrated circuit device. The circuit break device is configured to break an electrical path of the protection component for electrically terminating the protection component based upon a current signal.
Public/Granted literature
- US20160111867A1 METHODS OF POST-PROCESS DISPENSATION OF PLASMA INDUCED DAMAGE PROTECTION COMPONENT Public/Granted day:2016-04-21
Information query
