- 专利标题： Composition for forming conductive pattern and resin structure having conductive pattern
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申请号： US15510891申请日： 2015-09-17
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公开(公告)号： US10183866B2公开(公告)日： 2019-01-22
- 发明人: Han Nah Jeong , Chee-Sung Park , Ha Na Lee , Cheol-Hee Park , Jae Hyun Kim , Shin Hee Jun , Eun Kyu Seong , Su Jeong Lee
- 申请人： LG CHEM, LTD.
- 申请人地址： KR Seoul
- 专利权人： LG Chem, Ltd.
- 当前专利权人： LG Chem, Ltd.
- 当前专利权人地址： KR Seoul
- 代理机构： Dentons US LLP
- 优先权： KR10-2014-0123893 20140917; KR10-2015-0130984 20150916
- 国际申请： PCT/KR2015/009786 WO 20150917
- 国际公布： WO2016/043542 WO 20160324
- 主分类号： C08F4/00
- IPC分类号： C08F4/00 ; C08F2/00 ; C08G61/04 ; C01B15/16 ; H01B5/14 ; H01B1/02 ; H05K3/18 ; C01G3/00 ; C01G55/00 ; C08G75/0209 ; C08L55/02 ; C09D7/61 ; C08K3/32 ; C09D5/24 ; C09D169/00 ; H05K1/09 ; C08G65/38
摘要：
The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conductive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors. The composition for forming a conductive pattern, comprises: a polymer resin; and a non-conductive metal compound having a predetermined chemical structure, and may be a composition for forming a conductive pattern through electromagnetic irradiation, by which a metal nucleus is formed from the non-conductive metal compound.
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