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公开(公告)号：US10790428B2
公开(公告)日：2020-09-29
申请号：US15577195
申请日：2016-11-02
申请人： LG CHEM, LTD.
发明人： Yu Ho Min , Su Jeong Lee , Ye Seul Lee , Cheol-Hee Park , Jae Hyun Kim
摘要： The present invention relates to a P-type skutterudite thermoelectric material, a method for preparing the same, and a thermoelectric device including the same. More specifically, the present invention relates to a P-type skutterudite thermoelectric material into which a specific filler and charge compensator are introduced, and which exhibits high thermoelectric performance, a method for preparing the same, and a thermoelectric device including the same.
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公开(公告)号：US09872386B2
公开(公告)日：2018-01-16
申请号：US15503637
申请日：2015-09-01
申请人： LG CHEM, LTD.
发明人： Chee-Sung Park , Cheol-Hee Park , Ha Na Lee , Han Nah Jeong , Jae Hyun Kim , Shin Hee Jun , Eun Kyu Seong , Su Jeong Lee
CPC分类号： H05K1/09 , C08J7/123 , C08J2369/00 , C08K3/22 , C08K2003/2248 , C08K2003/2293 , C23C18/1612 , C23C18/1641 , C23C18/2013 , C23C18/204 , H01B1/22 , H01B5/14 , H01B13/00 , H05K1/0353 , H05K3/105 , H05K3/181 , H05K2201/032
摘要： The present invention relates to a composition for forming a conductive pattern which allows micro conductive patterns to be formed on various polymeric resin products or resin layers by a very simplified process, a method for forming a conductive pattern using the composition, and a resin structure having the conductive pattern. The composition for forming a conductive pattern comprises: a polymeric resin; and a nonconductive metallic compound including a first metal, a second metal and a third metal, wherein the nonconductive metallic compound has a three-dimensional structure including a plurality of first layers (edge-shared octahedral layers) having a structure in which octahedrons comprising two metals from among the first metal, the second metal and the third metal which share the edges thereof with one another are two-dimensionally connected to one other, and a second layer which includes a metal of a different type from the first layer and is arranged between adjacent first layers, and wherein a metallic core including the first metal, the second metal or the third metal or an ion thereof is formed from the nonconductive metallic compound by electromagnetic radiation.
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公开(公告)号：US10183866B2
公开(公告)日：2019-01-22
申请号：US15510891
申请日：2015-09-17
申请人： LG CHEM, LTD.
发明人： Han Nah Jeong , Chee-Sung Park , Ha Na Lee , Cheol-Hee Park , Jae Hyun Kim , Shin Hee Jun , Eun Kyu Seong , Su Jeong Lee
IPC分类号： C08F4/00 , C08F2/00 , C08G61/04 , C01B15/16 , H01B5/14 , H01B1/02 , H05K3/18 , C01G3/00 , C01G55/00 , C08G75/0209 , C08L55/02 , C09D7/61 , C08K3/32 , C09D5/24 , C09D169/00 , H05K1/09 , C08G65/38
摘要： The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conductive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors. The composition for forming a conductive pattern, comprises: a polymer resin; and a non-conductive metal compound having a predetermined chemical structure, and may be a composition for forming a conductive pattern through electromagnetic irradiation, by which a metal nucleus is formed from the non-conductive metal compound.
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公开(公告)号：US09992864B2
公开(公告)日：2018-06-05
申请号：US14912005
申请日：2015-04-16
申请人： LG CHEM, LTD.
发明人： Shin Hee Jun , Jae Hyun Kim , Cheol-Hee Park , Chee-Sung Park , Jae Jin Kim , Han Nah Jeong , Eun Kyu Seong , Su Jeong Lee
CPC分类号： H05K1/0296 , C09D5/24 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/405 , H05K1/0373 , H05K3/181 , C08K3/22 , C08L69/00
摘要： The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern reducing degradation of mechanical physical properties and having excellent adhesion strength, on a polymeric resin product or resin layer, a method for forming a conductive pattern using the same, and a resin component having the conductive pattern. The composition for forming a conductive pattern includes: a polycarbonate-based resin; and particles of a non-conductive metal compound including a first metal and a second metal and having a spinel structure, wherein the particles have a particle diameter of 0.1 to 6 μm; wherein a metal nuclei including the first metal, the second metal, or an ion thereof is formed from the particles of the non-conductive metal compound by electromagnetic wave irradiation. The non-conductive metal compound may have an average specific surface area of about 0.5 to 10 m2/g, preferably about 0.5 to 8 m2/g, more preferably about 0.7 to about 3 m2/g.
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公开(公告)号：US10344385B2
公开(公告)日：2019-07-09
申请号：US14910966
申请日：2014-08-07
申请人： LG CHEM, LTD.
发明人： Jae Hyun Kim , Shin Hee Jun , Jae Jin Kim , Chee-Sung Park , Eun Kyu Seong , Su Jeong Lee , Cheol-Hee Park , Han Nah Jeong , Sang Yun Jung
IPC分类号： C23C18/22 , C23C18/30 , C23C18/31 , C23C18/16 , C23C18/32 , C23C18/38 , C09D5/24 , C25D5/02 , C25D5/56 , C23C18/20 , H05K1/02 , H05K1/09 , H05K3/02 , H05K3/18
摘要： Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, and appropriately implementing the polymer resin products having white color or various colors, and the like, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed therefrom.The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing titanium dioxide (TiO2); forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.
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公开(公告)号：US09659682B2
公开(公告)日：2017-05-23
申请号：US14916100
申请日：2014-11-28
申请人： LG CHEM, LTD.
发明人： Chee-Sung Park , Jae Hyun Kim , Shin Hee Jun , Cheol-Hee Park , Eun Kyu Seong , Sang Yun Jung , Jae Jin Kim , Han Nah Jeong , Su Jeong Lee
CPC分类号： H01B1/22 , C08K3/22 , C08K2003/2248 , C08K2003/2262 , C09D5/24 , C09D7/61 , C09D7/68 , C09D11/52 , C09D169/00 , H05K1/095 , H05K3/105 , H05K3/106 , H05K3/185 , H05K2203/0514 , H05K2203/1157 , C08L69/00
摘要： The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.
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7.发明申请COMPOSITION FOR FORMING CONDUCTIVE PATTERN, METHOD FOR FORMING CONDUCTIVE PATTERN USING THE SAME, AND RESIN COMPONENTS HAVING CONDUCTIVE PATTERN THEREON 有权用于形成导电图案的组合物，使用其的形成导电图案的方法和具有导电图案的树脂组分公开(公告)号：US20160198569A1
公开(公告)日：2016-07-07
申请号：US14912005
申请日：2015-04-16
申请人： LG CHEM, LTD.
发明人： Shin Hee Jun , Jae Hyun Kim , Cheol-Hee Park , Chee-Sung Park , Jae Jin Kim , Han Nah Jeong , Eun Kyu Seong , Su Jeong Lee
CPC分类号： H05K1/0296 , C09D5/24 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/405 , H05K1/0373 , H05K3/181 , C08K3/22 , C08L69/00
摘要： The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern reducing degradation of mechanical physical properties and having excellent adhesion strength, on a polymeric resin product or resin layer, a method for forming a conductive pattern using the same, and a resin component having the conductive pattern. The composition for forming a conductive pattern includes: a polycarbonate-based resin; and particles of a non-conductive metal compound including a first metal and a second metal and having a spinel structure, wherein the particles have a particle diameter of 0.1 to 6 μm; wherein a metal nuclei including the first metal, the second metal, or an ion thereof is formed from the particles of the non-conductive metal compound by electromagnetic wave irradiation. The non-conductive metal compound may have an average specific surface area of about 0.5 to 10 m2/g, preferably about 0.5 to 8 m2/g, more preferably about 0.7 to about 3 m2/g.
摘要翻译： 本发明涉及一种用于形成导电图案的组合物，其能够形成导电图案，从而降低机械物理性能降低并且对聚合树脂产品或树脂层具有优异的粘合强度，使用该组合物形成导电图案的方法 ，以及具有导电图案的树脂成分。 用于形成导电图案的组合物包括：聚碳酸酯基树脂; 以及包含第一金属和第二金属并具有尖晶石结构的非导电金属化合物的颗粒，其中所述颗粒具有0.1至6μm的粒径; 其中通过电磁波照射由非导电金属化合物的颗粒形成包括第一金属，第二金属或其离子的金属核。 非导电金属化合物的平均比表面积可以为约0.5至10m 2 / g，优选约0.5至8m 2 / g，更优选约0.7至约3m 2 / g。
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