- 专利标题: Method of transferring reverse pattern by using imprint process
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申请号: US14733172申请日: 2015-06-08
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公开(公告)号: US10185218B2公开(公告)日: 2019-01-22
- 发明人: Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Jong G. Ok , Ilsun Yoon , Sunghoon Lee , Sukgyu Hahm
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRONICS CO., LTD
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD
- 当前专利权人地址: KR Gyeonggi-Do
- 代理机构: Cantor Colburn LLP
- 优先权: KR10-2014-0095015 20140725
- 主分类号: G03F7/00
- IPC分类号: G03F7/00
摘要:
A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
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