Invention Grant
- Patent Title: Method of transferring reverse pattern by using imprint process
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Application No.: US14733172Application Date: 2015-06-08
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Publication No.: US10185218B2Publication Date: 2019-01-22
- Inventor: Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Jong G. Ok , Ilsun Yoon , Sunghoon Lee , Sukgyu Hahm
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR10-2014-0095015 20140725
- Main IPC: G03F7/00
- IPC: G03F7/00

Abstract:
A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
Public/Granted literature
- US20160023400A1 METHOD OF TRANSFERRING REVERSE PATTERN BY USING IMPRINT PROCESS Public/Granted day:2016-01-28
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