- 专利标题： Methods of laser trace post processing and depaneling of assembled printed circuit boards
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申请号： US15112644申请日： 2015-01-20
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公开(公告)号： US10194533B2公开(公告)日： 2019-01-29
- 发明人: Scott Arthur McMullen , Peter Zosimadis
- 申请人： SMART WAVE TECHNOLOGIES, INC.
- 申请人地址： US MD Bethesda
- 专利权人： SMART WAVE TECHNOLOGIES, INC.
- 当前专利权人： SMART WAVE TECHNOLOGIES, INC.
- 当前专利权人地址： US MD Bethesda
- 代理机构： McDonnell Boehnen Hulbert & Berghoff LLP
- 国际申请： PCT/CA2015/050036 WO 20150120
- 国际公布： WO2015/106360 WO 20150723
- 主分类号： B23K26/351
- IPC分类号： B23K26/351 ; B23K26/38 ; H05K3/00 ; H05K1/02 ; B23K101/42 ; H05K3/26
摘要：
A method for processing a PCBa panel to individualize the PCBa's on the PCBa panel and depanel the PCBa panel in substantially one step is described. The PCBa panel initially comprises a number of PCBa's having components and traces common to a number of different product SKUs. During processing, the PCBa panel is loaded into a machine containing a first and second laser. The first laser severs extra traces on each PCBa to individualize the PCBa's for specific SKUs and the second laser cuts the links between each PCBa, thereby depaneling the PCBa panel.
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