SHEET PROCESSING METHOD AND SHEET PROCESSING APPARATUS

    公开(公告)号:US20220088713A1

    公开(公告)日:2022-03-24

    申请号:US17543867

    申请日:2021-12-07

    申请人: TOPPAN Inc.

    摘要: A sheet processing method including irradiating a transparent conductive layer covered with a transparent sheet with a pulsed laser beam such that the pulsed laser beam is applied to a portion of the transparent conductive layer through the transparent sheet, and that the portion irradiated has an insulating property. The pulsed laser beam has a top-hat intensity distribution and has a transmittance through the transparent sheet being higher than a transmittance through the transparent conductive layer.

    Peeling method and manufacturing method of flexible device

    公开(公告)号:US10741590B2

    公开(公告)日:2020-08-11

    申请号:US16087811

    申请日:2017-04-03

    摘要: A peeling method at low cost with high mass productivity is provided. A silicon layer having a function of releasing hydrogen by irradiation with light is formed over a formation substrate, a first layer is formed using a photosensitive material over the silicon layer, an opening is formed in a portion of the first layer that overlaps with the silicon layer by a photolithography method and the first layer is heated to form a resin layer having an opening, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, a conductive layer is formed to overlap with the opening of the resin layer and the silicon layer, the silicon layer is irradiated with light using a laser, and the transistor and the formation substrate are separated from each other.