Invention Grant
- Patent Title: Automatic deskew using design files or inspection images
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Application No.: US15258546Application Date: 2016-09-07
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Publication No.: US10204416B2Publication Date: 2019-02-12
- Inventor: Arpit Jain , Arpit Yati , Thirupurasundari Jayaraman , Raghavan Konuru , Raj Kuppa , Hema Prasad , Saiyashwanth Momula , Arun Lobo
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Priority: IN201641004030 20160204
- Main IPC: H04N7/18
- IPC: H04N7/18 ; G06T7/00 ; H01J37/22 ; G01N23/2251 ; H01L21/66

Abstract:
Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
Public/Granted literature
- US20170228866A1 AUTOMATIC DESKEW USING DESIGN FILES OR INSPECTION IMAGES Public/Granted day:2017-08-10
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