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公开(公告)号：US20170228866A1
公开(公告)日：2017-08-10
申请号：US15258546
申请日：2016-09-07
发明人： Arpit Jain , Arpit Yati , Thirupurasundari Jayaraman , Raghavan Konuru , Raj Kuppa , Hema Prasad , Saiyashwanth Momula , Arun Lobo
IPC分类号： G06T7/00 , G01N23/225 , H01L21/66 , H01J37/22
CPC分类号： H01L22/20 , G01N23/2251 , G01N2223/6116 , G06T3/608 , G06T7/001 , G06T2207/10061 , G06T2207/30148 , H01L22/12
摘要： Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
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公开(公告)号：US10204416B2
公开(公告)日：2019-02-12
申请号：US15258546
申请日：2016-09-07
发明人： Arpit Jain , Arpit Yati , Thirupurasundari Jayaraman , Raghavan Konuru , Raj Kuppa , Hema Prasad , Saiyashwanth Momula , Arun Lobo
IPC分类号： H04N7/18 , G06T7/00 , H01J37/22 , G01N23/2251 , H01L21/66
摘要： Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
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3.发明申请公开(公告)号：US20170040142A1
公开(公告)日：2017-02-09
申请号：US15227698
申请日：2016-08-03
发明人： Hemanta Kumar Roy , Arpit Jain , Arpit Yati , Olivier Moreau , Arun Lobo
CPC分类号： H01L22/00 , H01J2237/24571 , H01J2237/24592 , H01J2237/2817 , H01L22/12 , H01L22/20
摘要： A technique to identify non-visual defects, such as SEM non-visual defects (SNVs), includes generating an image of a layer of a wafer, evaluating at least one attribute of the image using a classifier, and identifying the non-visual defects on the layer of the wafer. A controller can be configured to identify the non-visual defects using the classifier. This controller can communicate with a defect review tool, such as a scanning electron microscope (SEM).
摘要翻译： 识别非视觉缺陷的技术，例如SEM非视觉缺陷（SNV），包括生成晶片层的图像，使用分类器评估图像的至少一个属性，以及识别非视觉缺陷 在晶片层上。 可以将控制器配置为使用分类器识别非视觉缺陷。 该控制器可以与诸如扫描电子显微镜（SEM）的缺陷检查工具进行通信。
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4.发明授权公开(公告)号：US10359706B1
公开(公告)日：2019-07-23
申请号：US16103386
申请日：2018-08-14
IPC分类号： G03F7/20
摘要： A sample analysis system includes a scanning electron microscope, an optical and/or eBeam inspection system, and an optical metrology system. The system further includes at least one controller. The controller is configured to receive a first plurality of selected regions of interest of the sample; generate a first critical dimension uniformity map based on a first inspection performed by the scanning electron microscope at the first selected regions of interest; determine a second plurality of selected regions of interest based on the first critical dimension uniformity map; generate a second critical dimension uniformity map based on a second inspection performed by the optical and/or eBeam inspection system at the second selected regions of interest; and determine one or more process tool control parameters based on inspection results and on overlay measurements performed on the sample by the optical metrology system.
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公开(公告)号：US09947596B2
公开(公告)日：2018-04-17
申请号：US15227698
申请日：2016-08-03
发明人： Hemanta Kumar Roy , Arpit Jain , Arpit Yati , Olivier Moreau , Arun Lobo
CPC分类号： H01L22/00 , H01J2237/24571 , H01J2237/24592 , H01J2237/2817 , H01L22/12 , H01L22/20
摘要： A technique to identify non-visual defects, such as SEM non-visual defects (SNVs), includes generating an image of a layer of a wafer, evaluating at least one attribute of the image using a classifier, and identifying the non-visual defects on the layer of the wafer. A controller can be configured to identify the non-visual defects using the classifier. This controller can communicate with a defect review tool, such as a scanning electron microscope (SEM).
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