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公开(公告)号：US09613411B2
公开(公告)日：2017-04-04
申请号：US14505446
申请日：2014-10-02
Applicant: KLA-Tencor Corporation
Inventor： Raghavan Konuru , Naema Bhatti , Michael Lennek , Martin Plihal
CPC classification number: G06T7/0004 , G06K9/6254 , G06K9/6282 , G06K2209/19
Abstract: Methods and systems for setting up a classifier for defects detected on a wafer are provided. One method includes generating a template for a defect classifier for defects detected on a wafer and applying the template to a training data set. The training data set includes information for defects detected on the wafer or another wafer. The method also includes determining one or more parameters for the defect classifier based on results of the applying step.
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公开(公告)号：US09996942B2
公开(公告)日：2018-06-12
申请号：US15073617
申请日：2016-03-17
Applicant: KLA-Tencor Corporation
Inventor： Santosh Bhattacharyya , Pavan Kumar , Lisheng Gao , Thirupurasundari Jayaraman , Raghav Babulnath , Srikanth Kandukuri , Gangadharan Sivaraman , Karthikeyan Subramanian , Raghavan Konuru , Rahul Lakhawat
CPC classification number: G06T7/33 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.
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公开(公告)号：US20160275672A1
公开(公告)日：2016-09-22
申请号：US15073617
申请日：2016-03-17
Applicant: KLA-Tencor Corporation
Inventor： Santosh Bhattacharyya , Pavan Kumar , Lisheng Gao , Thirupurasundari Jayaraman , Raghav Babulnath , Srikanth Kandukuri , Gangadharan Sivaraman , Karthikeyan Subramanian , Raghavan Konuru , Rahul Lakhawat
IPC: G06T7/00
CPC classification number: G06T7/33 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.
Abstract translation: 提供了用于确定由检查子系统在设计数据空间中产生的输出位置的方法和系统。 通常，这里描述的一些实施例被配置成用于将检测子系统产生的样品基本上精确地对准于试样的设计，尽管检查子系统输出中的设计变形。 此外，一些实施例被配置用于生成和/或使用可以在同一层的多个样本上共享的对准目标和用于将为样本生成的检查子系统输出对准样本的设计规则的设计规则。
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Patent Agency Ranking
公开(公告)号：US20190302031A1
公开(公告)日：2019-10-03
申请号：US16364098
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Saravanan Paramasivam , Ankit Jain , Prasanti Uppaluri , Raghavan Konuru
IPC: G01N21/88 , G01N21/956 , G01N21/95
Abstract: Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
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公开(公告)号：US10204416B2
公开(公告)日：2019-02-12
申请号：US15258546
申请日：2016-09-07
Applicant: KLA-Tencor Corporation
Inventor： Arpit Jain , Arpit Yati , Thirupurasundari Jayaraman , Raghavan Konuru , Raj Kuppa , Hema Prasad , Saiyashwanth Momula , Arun Lobo
IPC: H04N7/18 , G06T7/00 , H01J37/22 , G01N23/2251 , H01L21/66
Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
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公开(公告)号：US10670536B2
公开(公告)日：2020-06-02
申请号：US16364098
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Saravanan Paramasivam , Ankit Jain , Prasanti Uppaluri , Raghavan Konuru
IPC: G01N21/88 , G01N21/95 , G01N21/956
Abstract: Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
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公开(公告)号：US20170228866A1
公开(公告)日：2017-08-10
申请号：US15258546
申请日：2016-09-07
Applicant: KLA-Tencor Corporation
Inventor： Arpit Jain , Arpit Yati , Thirupurasundari Jayaraman , Raghavan Konuru , Raj Kuppa , Hema Prasad , Saiyashwanth Momula , Arun Lobo
IPC: G06T7/00 , G01N23/225 , H01L21/66 , H01J37/22
CPC classification number: H01L22/20 , G01N23/2251 , G01N2223/6116 , G06T3/608 , G06T7/001 , G06T2207/10061 , G06T2207/30148 , H01L22/12
Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
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公开(公告)号：US20150262038A1
公开(公告)日：2015-09-17
申请号：US14505446
申请日：2014-10-02
Applicant: KLA-Tencor Corporation
Inventor： Raghavan Konuru , Naema Bhatti , Michael Lennek , Martin Plihal
CPC classification number: G06T7/0004 , G06K9/6254 , G06K9/6282 , G06K2209/19
Abstract: Methods and systems for setting up a classifier for defects detected on a wafer are provided. One method includes generating a template for a defect classifier for defects detected on a wafer and applying the template to a training data set. The training data set includes information for defects detected on the wafer or another wafer. The method also includes determining one or more parameters for the defect classifier based on results of the applying step.
Abstract translation: 提供了用于设置在晶片上检测到的缺陷的分类器的方法和系统。 一种方法包括为在晶片上检测到的缺陷生成用于缺陷分类器的模板并将模板应用于训练数据集。 训练数据集包括在晶片或另一晶片上检测到的缺陷的信息。 该方法还包括基于应用步骤的结果确定缺陷分类器的一个或多个参数。
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