Invention Grant
- Patent Title: Stacked package module having an exposed heat sink surface from the packaging
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Application No.: US15826714Application Date: 2017-11-30
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Publication No.: US10204882B2Publication Date: 2019-02-12
- Inventor: Le Liang , Shou-Yu Hong , Zhen-Qing Zhao
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., Ltd.
- Priority: CN201510307039 20150605
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/00 ; H05K7/10 ; H01L25/065 ; H01L21/56 ; H01L23/433 ; H01L23/495 ; H01L23/31
Abstract:
A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.
Public/Granted literature
- US20180082980A1 PACKAGE MODULE, STACK STRUCTURE OF PACKAGE MODULE, AND FABRICATING METHODS THEREOF Public/Granted day:2018-03-22
Information query
IPC分类:
