公开(公告)号：US09697950B2

公开(公告)日：2017-07-04

申请号：US14696382

申请日：2015-04-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H01F27/29 ,  H05K1/14 ,  H05K7/02 ,  H01F27/28 ,  H01F17/00 ,  H01F17/04 ,  H02M3/00 ,  H05K3/34

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical component is disclosed, the electrical component comprising: a magnetic body having a top surface, a bottom surface, wherein at least one first conductive through hole is formed from the top surface to bottom surface of the magnetic body; and a coil disposed in the magnetic body, wherein a first end of the coil is electrically connected to one of the at least one first conductive through hole.

公开(公告)号：US09287765B2

公开(公告)日：2016-03-15

申请号：US13845118

申请日：2013-03-18

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong ,  Xue-Tao Guo

IPC: H05K7/20 ,  H03L5/00 ,  H02M1/14 ,  H01L25/00 ,  H02M7/00 ,  H05K7/14 ,  H01L23/00 ,  H05K5/06 ,  H01L23/473 ,  H01L23/367 ,  H02M7/5388

CPC classification number: H02M1/143 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/50 ,  H01L2224/0603 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/49111 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  H02M7/5388 ,  H05K5/064 ,  H05K7/1432 ,  H05K7/209 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48472 ,  H01L2924/00012

Abstract: A power system, a power module therein and a method for fabricating power module are disclosed herein. The power module includes a first and a second common pins, and a first and a second bridge arms. The first and the second common pins are symmetrically disposed at one side of a substrate. The first bridge arm includes a first and a second semiconductor devices, and the first and the second semiconductor devices are connected to each other through the first common pin and disposed adjacently. The second bridge arm includes a third and a fourth semiconductor devices, and the third and the fourth semiconductor devices are connected to each other through the second common pin and disposed adjacently. The first and the third semiconductor devices are disposed symmetrically, and the second and the fourth semiconductor devices are disposed symmetrically.

Abstract translation: 本文公开了一种电力系统及其功率模块及其制造功率模块的方法。 功率模块包括第一和第二公共引脚，以及第一和第二桥臂。 第一和第二公共销对称地设置在基板的一侧。 第一桥臂包括第一和第二半导体器件，并且第一和第二半导体器件通过第一公共引脚彼此连接并相邻地设置。 第二桥臂包括第三和第四半导体器件，并且第三和第四半导体器件通过第二公共引脚彼此连接并相邻地设置。 第一和第三半导体器件对称设置，第二和第四半导体器件对称地设置。

公开(公告)号：US09030027B2

公开(公告)日：2015-05-12

申请号：US14094811

申请日：2013-12-03

Applicant: Delta Electronics, Inc.

Inventor： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H01L23/02 ,  H05K7/02 ,  H05K1/14 ,  H01F17/00 ,  H01F17/04 ,  H02M3/00 ,  H05K3/34

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.

Abstract translation: 公开了组装电路，其中组装电路包括具有顶表面，底表面和侧表面的电感器，其中多个导体中的每一个通过电感器的一个侧表面从顶表面延伸到底表面 其中电路板设置在所述第一电子部件的顶表面上并电连接到所述多个导体，以及设置在所述电感器的底表面上的多个引脚用于连接到另一个电路板。

公开(公告)号：US09819263B2

公开(公告)日：2017-11-14

申请号：US15286542

申请日：2016-10-05

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong ,  Xiao-Ni Xin ,  Pei-Qing Hu

IPC: H02M3/156 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H01F27/24 ,  H05K3/30 ,  H05K1/11 ,  H01F27/28 ,  H05K3/40 ,  H05K1/14

CPC classification number: H02M3/156 ,  H01F27/24 ,  H01F27/28 ,  H01F27/292 ,  H01F41/02 ,  H05K1/028 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/18 ,  H05K1/181 ,  H05K3/22 ,  H05K3/305 ,  H05K3/4038 ,  H05K2201/1003 ,  H05K2201/10946 ,  H05K2203/02 ,  H05K2203/0228

Abstract: A power converter includes a carrier, a first electronic component, a second electronic component, and a connection part. The first electronic component is disposed on the bottom surface of the carrier. The second electronic component is disposed on the top surface of the carrier. A first terminal of the connection part is coupled to the top surface or the bottom surface of the carrier. A second terminal of the connection part is a bonding pad and attached to the first electronic component's surface apart from the carrier. The carrier is disposed at ⅓ to ⅔ of a height of the power-converter. The connection part is fabricated by mechanical support of the first electronic component.

公开(公告)号：US10204882B2

公开(公告)日：2019-02-12

申请号：US15826714

申请日：2017-11-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Shou-Yu Hong ,  Zhen-Qing Zhao

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/10 ,  H01L25/065 ,  H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/31

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.

公开(公告)号：US09875991B2

公开(公告)日：2018-01-23

申请号：US15071215

申请日：2016-03-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Shou-Yu Hong ,  Zhen-Qing Zhao

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49555 ,  H01L23/49575 ,  H01L25/0657

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.