公开(公告)号：US10096562B2

公开(公告)日：2018-10-09

申请号：US15209777

申请日：2016-07-14

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Kai Lu ,  Zhen-Qing Zhao ,  Zeng Li

IPC: H01L29/15 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L25/18

Abstract: A power module package includes a single-layered circuit board, a first electronic component, and a second electronic component. The single-layered circuit board includes an insulating substrate and a conductive layer thereon. A bottom surface of the conductive layer touches a top surface of the insulating substrate. The insulating substrate has plural first openings to allow the conductive layer to be exposed from the bottom surface of the insulating substrate. The first electronic component is disposed on a top surface of the conductive layer. The second electronic component is disposed on the bottom surface of the insulating substrate and received in the first openings. The second electronic component is connected to the conductive layer via the first openings. At least one of the first electronic component and the second electronic component is a bare die.

公开(公告)号：US09698701B2

公开(公告)日：2017-07-04

申请号：US15168235

申请日：2016-05-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Zeng Li ,  Jun-Cheng Lu ,  Tao Wang ,  Zheng-Fen Wan ,  Zhen-Qing Zhao

IPC: H01L23/495 ,  H01L21/50 ,  H02M7/00 ,  H01L23/498 ,  H01L25/18 ,  H01L25/07 ,  H01L21/48 ,  H01L23/00

CPC classification number: H02M7/003 ,  H01L21/4846 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/2743 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.

公开(公告)号：US10204882B2

公开(公告)日：2019-02-12

申请号：US15826714

申请日：2017-11-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Shou-Yu Hong ,  Zhen-Qing Zhao

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/10 ,  H01L25/065 ,  H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/31

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.

公开(公告)号：US09875991B2

公开(公告)日：2018-01-23

申请号：US15071215

申请日：2016-03-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Shou-Yu Hong ,  Zhen-Qing Zhao

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49555 ,  H01L23/49575 ,  H01L25/0657

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.

公开(公告)号：US10276522B2

公开(公告)日：2019-04-30

申请号：US14819446

申请日：2015-08-06

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Zhen-Qing Zhao ,  Kai Lu ,  Zheng-Fen Wan ,  Hai-Bin Xu

IPC: H05K3/34 ,  H01L23/00

Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.