- Patent Title: Junction structure for an electronic device and electronic device
-
Application No.: US14219766Application Date: 2014-03-19
-
Publication No.: US10205250B2Publication Date: 2019-02-12
- Inventor: Kenichi Yoshida , Yuhei Horikawa , Hisayuki Abe
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-069879 20130328
- Main IPC: B32B15/01
- IPC: B32B15/01 ; H01R4/02 ; B23K35/00 ; H05K3/34 ; H05K3/40 ; H01L23/00
Abstract:
A junction structure for electronic device having an excellent bonding strength is provided. A junction structure for electronic device in accordance with one aspect of the present invention includes a first metal layer containing nickel and a second metal layer containing gold, tin, and nickel, while the second metal layer includes an AuSn eutectic phase.
Public/Granted literature
- US20140291021A1 JUNCTION STRUCTURE FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE Public/Granted day:2014-10-02
Information query
