公开(公告)号：US11031330B2

公开(公告)日：2021-06-08

申请号：US16811018

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US10354796B2

公开(公告)日：2019-07-16

申请号：US15840243

申请日：2017-12-13

Applicant: TDK Corporation

Inventor： Yuhei Horikawa ,  Makoto Orikasa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hirohumi Asou ,  Kosuke Kunitsuka

IPC: H01F41/04 ,  H01F41/10 ,  C25D13/22 ,  C23C18/16 ,  C25D13/12 ,  G06K19/077 ,  H01Q1/38 ,  H01Q1/36 ,  H01Q9/27 ,  H05K3/24 ,  H05K3/18 ,  C25D5/48 ,  H01Q1/48 ,  H01Q7/00

Abstract: Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.

公开(公告)号：US10205250B2

公开(公告)日：2019-02-12

申请号：US14219766

申请日：2014-03-19

Applicant: TDK CORPORATION

Inventor： Kenichi Yoshida ,  Yuhei Horikawa ,  Hisayuki Abe

IPC: B32B15/01 ,  H01R4/02 ,  B23K35/00 ,  H05K3/34 ,  H05K3/40 ,  H01L23/00

Abstract: A junction structure for electronic device having an excellent bonding strength is provided. A junction structure for electronic device in accordance with one aspect of the present invention includes a first metal layer containing nickel and a second metal layer containing gold, tin, and nickel, while the second metal layer includes an AuSn eutectic phase.

公开(公告)号：US09257402B2

公开(公告)日：2016-02-09

申请号：US13960330

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi Yoshida ,  Makoto Orikasa ,  Hideyuki Seike ,  Yuhei Horikawa ,  Hisayuki Abe

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2224/05572 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer.

Abstract translation: 优选的端子结构包括基材; 形成在基材上的电极; 绝缘覆盖层，形成在所述基底材料上和所述电极上，并且具有暴露所述电极的至少一部分的开口; 在所述电极的开口部的区域形成含有Ni的下凸块金属层，使得所述金属层的上表面位于比所述开口的周缘部的绝缘覆盖层的上表面低的位置; 以及形成在下凸块金属层的开口部的区域中的包含Sn和Ti的圆顶状的凸部，其中，下凸块状金属层与凸块之间的边界的端部与内凸块 绝缘覆盖层的开口部。

公开(公告)号：US20130135834A1

公开(公告)日：2013-05-30

申请号：US13677432

申请日：2012-11-15

Applicant: TDK CORPORATION

Inventor： Yuhei Horikawa ,  Shin Fujita ,  Kenichi Yoshida ,  Hisayuki Abe ,  Makoto Orikasa ,  Hideyuki Seike

IPC: H05K1/11 ,  H01R43/00 ,  H01R4/02

CPC classification number: H05K1/11 ,  H01R4/02 ,  H01R43/00 ,  H05K1/111 ,  H05K1/141 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/49204

Abstract: The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.

Abstract translation: 电子设备包括端子结构和包括端子结构的印刷电路板。 端子结构包括放置在布线导体上的焊点导体区域，与导体区域接触的中间层以及与中间层接触的焊料区域。 中间层包括包含锡和铜和镍中的至少一种作为主要成分的金属间化合物。 当导体区域的压痕弹性模量为E1，中间层的压痕弹性模量为E2时，E1与E2的比例等于或大于0.8且等于或小于1.5。

公开(公告)号：US11410855B2

公开(公告)日：2022-08-09

申请号：US16997092

申请日：2020-08-19

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L21/48 ,  G03F7/00 ,  H01L33/62 ,  C23C18/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  H01L23/00 ,  C23C18/38 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US09620156B2

公开(公告)日：2017-04-11

申请号：US15071989

申请日：2016-03-16

Applicant: TDK CORPORATION

Inventor： Katsuhiko Igarashi ,  Makoto Orikasa ,  Takashi Kawashima ,  Hisayuki Abe

IPC: G11B5/48

CPC classification number: G11B5/4833 ,  G11B5/4826

Abstract: A magnetic head device with high joint strength in an arm and a suspension is provided. The magnetic head device comprises an arm, a suspension overlapping with a leading end part of the arm, a slider located at a leading end part of the suspension, and a joint part that is located between the leading end part of the arm and the suspension and that joins the arm and the suspension, while the joint part includes Sn.

公开(公告)号：US09144166B2

公开(公告)日：2015-09-22

申请号：US13958966

申请日：2013-08-05

Applicant: TDK CORPORATION

Inventor： Miyuki Yanagida ,  Hisayuki Abe

IPC: H01G4/005 ,  H05K7/00 ,  H01G4/232

CPC classification number: H05K7/00 ,  H01G4/232

Abstract: One aspect of an electronic component is an electronic component comprising an element body having a mounting surface and a plurality of side faces, the electronic component further comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, a metal film disposed on a surface of a mounting part of the first and second terminal electrodes formed on the mounting surface, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces.

Abstract translation: 电子部件的一个方面是电子部件，其包括具有安装面和多个侧面的元件主体，所述电子部件还包括形成在所述安装面上的第一端子电极和所述多个侧面中的一个， 形成在所述安装面上的端子电极和所述多个侧面中的另一个侧面，设置在形成在所述安装面上的所述第一和第二端子电极的安装部的表面上的金属膜，以及至少覆盖 形成在侧面上的第一和第二端子电极的侧面部分的表面的一部分。

公开(公告)号：US08787028B2

公开(公告)日：2014-07-22

申请号：US13677432

申请日：2012-11-15

Applicant: TDK Corporation

Inventor： Yuhei Horikawa ,  Shin Fujita ,  Kenichi Yoshida ,  Hisayuki Abe ,  Makoto Orikasa ,  Hideyuki Seike

IPC: H05K7/00 ,  H05K1/02 ,  H01R43/02

CPC classification number: H05K1/11 ,  H01R4/02 ,  H01R43/00 ,  H05K1/111 ,  H05K1/141 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/49204

Abstract: The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.

Abstract translation: 电子设备包括端子结构和包括端子结构的印刷电路板。 端子结构包括放置在布线导体上的焊点导体区域，与导体区域接触的中间层以及与中间层接触的焊料区域。 中间层包括包含锡和铜和镍中的至少一种作为主要成分的金属间化合物。 当导体区域的压痕弹性模量为E1，中间层的压痕弹性模量为E2时，E1与E2的比例等于或大于0.8且等于或小于1.5。

公开(公告)号：US11466368B2

公开(公告)日：2022-10-11

申请号：US16046422

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Makoto Orikasa ,  Yuhei Horikawa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hiroki Ashizawa ,  Miho Mori ,  Misaki Tamura

IPC: C23C18/16 ,  C23C18/31 ,  H05K1/03 ,  H05K3/06 ,  H05K3/18 ,  B32B15/00 ,  C23C18/38 ,  C23C18/30 ,  C23C18/32

Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.