A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.