An apparatus for workload management includes a thermal relationship module, a thermal effect module, and a resource allocation module. The thermal relationship module determines a plurality of thermal relationships among components of an electronic device. Each thermal relationship quantifies a thermal impact on one of the components of utilizing another of the components. The thermal effect module determines one or more potential thermal effects of a workload on the components based on the thermal relationships. The one or more potential thermal effects correspond to one or more possible allocations of resources of at least a portion of the components to run the workload. The resource allocation module selects an allocation of resources from the one or more possible allocations of resources to run the workload, based on the determined potential thermal effects.