An integrated circuit device having improved delamination properties is provided. The integrated circuit may include a leadframe having a die support area supporting an integrated circuit die, and a plurality of leadframe leads. Surfaces of the leadframe leads are roughened by a roughening process to form roughened surfaces having an average roughness Ra. A thin plating layer is formed over the roughened leadframe lead surfaces, with a plating layer thickness of less than 40 times the roughness Ra of the leadframe lead surfaces, such that the thin plating layer is received into the roughened leadframe lead surface contours and thereby itself has a contoured outer surface. A molding material applied to the structure may directly contact and adhere to the contoured surface of the thin plating layer. The adhesion between the molding material and the contoured plating layer may reduce or eliminate delamination of the molding material from the leadframe.