Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15911236Application Date: 2018-03-05
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Publication No.: US10211293B2Publication Date: 2019-02-19
- Inventor: Tsutomu Kiyosawa , Atsushi Ohoka
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2017-058779 20170324
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L29/78 ; H01L29/16 ; H01L29/417 ; H01L29/32 ; H01L29/872 ; H01L29/08 ; H01L29/66 ; H01L29/06 ; H01L29/10 ; H01L21/02 ; H01L21/04

Abstract:
Semiconductor device 101 includes semiconductor substrate 10, drift layer 20, first electrode 50, and second electrode 60. Semiconductor substrate 10 is of a first conductivity type and is formed of a silicon carbide semiconductor, a gallium nitride semiconductor, or the like. For example, semiconductor substrate 10 is an n-type silicon carbide semiconductor substrate. Drift layer 20 is an epitaxial semiconductor layer of the first conductivity type which is formed on upper surface 10a of semiconductor substrate 10 by epitaxial growth. Drift layer 20 is formed of for example, an n-type silicon carbide semiconductor. Drift layer 20 has a thickness of t. For example, the thickness t is between about 5 μm and about 100 μm (inclusive).
Public/Granted literature
- US20180277636A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-09-27
Information query
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