- 专利标题： Piezoelectric wafer, piezoelectric vibration piece, and piezoelectric vibrator
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申请号： US15036734申请日： 2014-09-17
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公开(公告)号： US10211807B2公开(公告)日： 2019-02-19
- 发明人: Tomo Fujii , Kozo Shibutani , Satoru Ishino , Yoshinari Morimoto , Tadataka Koga , Kazuki Otani
- 申请人： DAISHINKU CORPORATION
- 申请人地址： JP Hyogo
- 专利权人： Daishinku Corporation
- 当前专利权人： Daishinku Corporation
- 当前专利权人地址： JP Hyogo
- 代理机构： Norris McLaughlin, P.A.
- 优先权： JP2013-235325 20131113; JP2013-242351 20131122; JP2013-242352 20131122; JP2013-242353 20131122
- 国际申请： PCT/JP2014/004781 WO 20140917
- 国际公布： WO2015/072056 WO 20150521
- 主分类号： H01L41/047
- IPC分类号： H01L41/047 ; H01L41/09 ; H01L41/22 ; H03H9/21 ; H03H9/05 ; H03H9/215 ; H01L41/053 ; H01L41/33 ; H03H9/02 ; H03H9/10 ; H03H3/02
摘要：
This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. The piezoelectric vibration piece is broken off at the coupling portion and separated from the piezoelectric wafer. On front and back surfaces of the coupling portion, grooved slits extending along a width direction of the coupling portion are formed except for parts of the coupling portion in the width direction. An electrode on at least one of front and back surfaces of the piezoelectric vibration piece is extracted to a frame-portion side of the piezoelectric wafer by way of the part of the coupling portion in the width direction.
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